Less than a month after the Dimensity 9400 launch, we already have a couple of flagship devices featuring this processor. More are expected to launch later this year and in 2025. While the Dimensity 9400 is MediaTek’s flagship offering, we also expect a sub-premium Dimensity 8400 SoC from MediaTek by the end of the year.

A well-known tipster on Weibo, Digital Chat Station, now has revealed the first details about the processor’s core structure.  

MediaTek Dimensity 8400 Specifications

According to DCS, the Dimensity 8400 will use TSMC’s 4nm manufacturing process, the same as its predecessor. However, the real highlight of the SoC could be its “full-core” or all-big-core architecture.

MediaTek embraced the all-big core design for its SoCs, starting with the Dimensity 9300. The Dimensity 9400 continues this trend, and Qualcomm has also announced its latest flagship SoC, the Snapdragon 8 Elite, with an all-big-core design.

If the new leak from DCS is accurate, MediaTek may introduce a similar architecture for the Dimensity 8400. The prime core in this SoC appears to be the new ARM Cortex-A725.

With this new architecture, the tipster claims the SoC will achieve an AnTuTu benchmark score between 1.7 and 1.8 million. For reference, the tipster notes that the Snapdragon 8 Gen 2 scores around 1.6 million, while the Snapdragon 8 Gen 3 scores about 2 million. This means the Dimensity 8400 will outperform the 8 Gen 2 and get closer to the performance levels of the 8 Gen 3.

While MediaTek has not announced a launch date for the Dimensity 8400, the SoC recently appeared in Xiaomi’s HyperOS codebase. This suggests that either a Xiaomi, Redmi, or Poco device featuring the chip is in development. The chipset carries the model number “MT6899.”