Samsung Electronics has recently completed NVIDIA's quality test (QualTest) for the delivery of HBM3E (8-stack) memory, marking a significant milestone in the semiconductor industry. This development comes as Samsung begins shipping HBM3E (8-stack) products to NVIDIA, a move that is expected to have substantial implications for the tech giant's upcoming product lineup.

According to TrendForce, "This year, NVIDIA's product lineup will make waves with the H200 being the first GPU (Graphics Processing Unit) to feature HBM3E 8-stack memory." The soon-to-be-released Blackwell chip is also expected to fully adopt HBM3E, the fifth generation of high bandwidth memory, which promises enhanced performance and efficiency.

Micron and SK Hynix, two other major players in the semiconductor market, completed HBM3E certification in the first quarter of this year and began mass shipments in the second quarter. TrendForce noted, "Micron mainly supplies the H200, while SK Hynix supplies both the H200 and B100 series." Samsung, although entering the market somewhat later, has recently completed HBM3E certification and started shipping HBM3E 8-stack products for the H200. Certification for the Blackwell series by Samsung is also progressing smoothly.

Reuters reported last month that Samsung Electronics had passed the QualTest for delivering HBM3E (8-stack) to NVIDIA. The report also mentioned that Samsung Electronics and NVIDIA are expected to sign a supply contract soon, with deliveries anticipated to begin in the fourth quarter. However, the test for the 12-stack version of the fifth generation HBM, HBM3E, is still ongoing.

NVIDIA's Blackwell-based B100 and B200 GPUs will be equipped with eight 8-stack HBM3E modules, while the lightweight version B200A will feature four 12-stack HBM3E modules. The Blackwell Ultra will incorporate eight 12-stack HBM3E modules, showcasing the versatility and scalability of the new memory technology.

Samsung Electronics, while unable to confirm specific details related to their customers, stated, "We are conducting tests with major customers." This statement underscores the company's commitment to ensuring the reliability and performance of their products before they reach the market.

The adoption of HBM3E by NVIDIA is a significant development in the tech industry, given the company's leading role in GPUs, which are essential for gaming, professional visualization, Data Centers, and AI applications. The integration of HBM3E is expected to provide substantial performance improvements, making NVIDIA's upcoming product lineup highly anticipated.

As the competition between major semiconductor companies like Samsung, Micron, and SK Hynix intensifies, the race to bring the latest memory technologies to market continues to shape the industry's landscape. The successful certification and shipment of HBM3E by Samsung mark a critical step in this ongoing technological evolution.

With the fourth quarter approaching, the industry will be closely watching the developments between Samsung and NVIDIA, particularly the anticipated supply contract and the commencement of deliveries.