MediaTek MT6789 (G99) LTE-A smartphone application processor datasheet

2024.12.04

Technical Blog

With integrated Bluetooth, FM, WLAN and GPS modules, the MediaTek MT6789 is a highly integrated baseband platform that combines modem and application processing subsystems to support LTE/LTE-A and C2K smartphone applications. The chip integrates two Arm®Cortex-A76 cores running at up to 2.2GHz, six Arm®Cortex-A55 cores running at up to 2.0GHz, and a powerful multi-standard video codec. In addition, an extensive set of interfaces and connectivity peripherals for connecting cameras, touchscreen displays, and UFS/MMC/SD cards are included. The application processor, equipped with the multi-core Arm®Cortex-A76, Arm®Cortex-A55NEON engine, provides the processing power needed to support the latest OpenOS and its demanding applications such as web browsing, email, GPS navigation and gaming. All content is viewed on a high-resolution touchscreen display, and graphics are enhanced with 2D and 3D graphics acceleration. Multi-standard video accelerators and advanced audio subsystems are also integrated to provide advanced multimedia applications and services, such as streaming audio and video, multiple decoders and encoders. The MT6789 provides a powerful modem subsystem that supports LTE downlink Category 13, LTE uplink Category 7, as well as WCDMA, CDMA20001xRTT/EVDO, GSM/EDGE. The MT6789 also embodies Wireless Communication devices, including WLAN, Bluetooth, and GPS. The MT6789 integrates four advanced radio technologies into a single chip, providing the industry's best and most convenient connectivity solution. The overall quality of simultaneous voice, data, and audio/video transmission on mobile phones and media tablets has been improved. The small footprint and low power consumption greatly reduce the PCB layout resources.

MT6789 Features: • 2 Arm®Cortex-A76 cores operating at 2.2GHz • 6 Arm®Cortex-A55 cores operating at 2.0GHz • Up to 12GB LPDDR4X-4266 SDRAM (2 channels, one 16-bit data bus per channel) •LTECat-13 • Embedded connectivity systems, including WLAN/BT/FM/GPS • Resolution up to FHD+ (1080*2520) • OpenGLES3.23D graphics accelerator • ISP support 32MP@30fps • H.265 2560*1440@30fps, 8-bit decoder • H.265 2560*1440@30fps, 8-bit encoder • Voice codecs (FR, HR, EFR, AMRFR, AMRHR, wideband AMR, and EVS_WB) Features: • APMCU subsystem −2 x Arm®2.2GHz Cortex-A76 cores, each with 64KB L1 I-cache, 64KB L1 D-cache, and 256KB L2 cache −6 x Arm®2GHz Cortex-A55 cores, each with 32KB L1 I-cache, 32KB L1 D-cache, and 128KB L2 cache − Shared 1MB L3 cache −NEON technology, advanced SIMDv2 for accelerated multimedia processing − Vector floating-point coprocessor extension, VFPv4 −DVFS technology with adaptive operating voltage from 0.55V to 0.9V • MD MCU subsystem −High-performance multi-core and multi-threaded processor architecture

−High-performance AXI bus interface

−Generic DMA engine and dedicated DMA channel for peripheral data transfer − Clock-gated power management • MD external interface −Dual SIM/USIM interfaces −Interface pins for RF and radio-related peripherals (antenna tuners, PAs, etc.). •safe −Arm®TrustZone® security −Embedded engines for Full Disk Encryption (FDE) and File-Based Encryption (FBE). −MediaTek CryptoCore • External memory interface − Up to 12GB LPDDR4X-4266 SDRAM −Two channels, each with a 16-bit data bus −Dual-row device support −Self-refresh/Partial Array Self-Refresh (PASR) command support − High-level command arbitration − Well-designed energy-saving technology •peripheral −USB2.0OTG mode −eMMC5.1 −UFS2.2 −3 UARTs for debugging and application −6 SPI masters for external devices −3 I2C/7I3C for controlling peripherals such as CMOS image sensors, LCM or FM receiver modules −Up to 3 PWM channels (depending on system configuration and I/O usage) −I2S for connecting an optional external high-end audio codec −GPIO −2 sets of memory card interfaces, supporting SD/SDHC/MMC and SDIO2.0/3.0 protocols