The MediaTek MT6799 hardware family is a highly integrated baseband platform that includes a modem and application processing subsystem. The chip integrates ARM®Artemis running up to 2.6GHz, ARM®Cortex-A53 running up to 2.2GHz, ARM®Cortex-A35 running up to 1.9GHz, a MIPS@interAptiv MCU, and a powerful multi-standard video codec. In addition, an extensive set of interfaces and connectivity peripherals for connecting cameras, touchscreen displays, and UFS/eMMC/sd cards are included. The application processor is a Tri-cluster with multi-core ARM®Artemis, ARM®Cortex-A53MP Core, and ARM®Cortex-A35MP Core equipped with NEON engine, providing the processing power needed to support the latest OpenOS and its demanding applications such as web browsing, email, GPS navigation, and gaming. Everything can be viewed on a high-resolution touchscreen display and enhanced with 2D and 3D graphics acceleration. Multi-standard video accelerators and advanced audio subsystems are also integrated to provide advanced multimedia applications and services, such as streaming audio and video, a large number of decoders and encoders. The MIPS®inter Aptiv, DSP, and 2G and 3G coprocessor combinations provide a robust modem subsystem capable of supporting LTECat7/10, Category 29 HSDPA downlink and Category 8 HSUPA uplink data rates, Category 14 TD-HSDPA downlink and Category 6 TD-HSUPA uplink, as well as Category 12 GPRS, EDGE.


peculiarity ●Dual-core ARM® Artemis MPCoreTM running at up to 2.6GHz ●Quad-core ARM® Cortex-A53 MPCoreTM running at 2.2GHz ●Quad-core ARM® Cortex-A35 MPCoreTM running at 1.9GHz ●LPDDR4/4x up to 8GB, 1600MHz ●LTE Cat 7/10 (300/450Mps) ●Resolution up to WQXGA ● IMG® 7XTP-MT x4 3D graphics ● OpenGL ES 3.1 3D graphics accelerator ●ISP supports 28MP@30fps, 14-bit ● Flexible and reconfigurable image processing unit to take advantage of ISPs ●HEVC 8/10-bit 4K2K@30fps decoder ●VP9 4K2K@30fps encoder ●Headset ANC/Mobile ANC ●Dedicated audio DSP (Cortex-M4) Platform features ●APMCU subsystem - Dual-core ARM®2.6GHz Artemis MPCore with 64KBL1I-cache, 64KBL1D-cache, and 1MB unified L2 cache - Quad-core ARM®2.2GHz Cortex-A53 MPCore with 32KBL1I-cache, 32KBL1D-cache and 512KB unified L2 cache - Quad-core ARM®1.9GHz Cortex-A35 MPCore with 32KBL1I-cache, 32KBL1D-cache and 512KB unified L2 cache - NEON multimedia processing engine with SIMDv2/VFPv4 ISA support -DVFS technology with an adaptive operating voltage of 0.55V to 1.0V
●MD MCU subsystem - MIPS®interAptiv processor with a maximum operating frequency of 900MHz -64KBI-cache，32KBD-cache -384/128KBI-D/TCM (tightly coupled memory) -512KB Unified L2 Cache -Coresonic DSP is used to run LTE modem tasks -FD216DSP is used to run modem/voice tasks, maximum. 312MHz operating frequency - High-performance AXI and AHB bus - Universal DMA engine and dedicated DMA channels for peripheral data transfer - Watchdog timer for system error recovery - Clock-gated power management ●MD external interface - Dual SIM/USIM interfaces - Interface pins with RF and radio-related peripherals (antenna tuners, PAs, etc.). ● Safety -ARM®TrustZone® security - UFS online encryption and full disk encryption engine -ARM®CryptoCell ● External memory interface - LPDDR4/4x up to 8GB - Four-channel, 16-bit data bus width - Memory clock up to 1600MHz - Self-refresh/partially self-refresh mode - Low power operation - Programmable slew rate of memory controller IO pads - Dual column storage device - Advanced bandwidth quorum control