Bluetooth Audio SoC

QCC-3004-1-68CSP-TR-00-0

  • The Qualcomm QCC-3004 is designed as a cost-effective yet powerful Bluetooth audio chip, aimed at delivering reliable performance in wireless audio devices while ensuring efficient power management. It is particularly suitable for applications such as wireless headphones, earbuds, and Bluetooth speakers.The QCC-3004 is compatible with Bluetooth 5.0, which offers faster data transmission, a more stable connection, and greater range. The chip includes an integrated Digital Signal Processor (DSP) that enhances audio quality by enabling real-time audio processing.

产品描述

The Qualcomm QCC-3004-1-68CSP-TR-00-0 is a highly efficient Bluetooth audio chip that combines low power consumption with reliable wireless performance. Designed for wireless earphones, portable speakers, and other consumer electronics, the QCC-3004 provides a cost-effective solution for manufacturers while maintaining essential features needed for high-quality audio devices.

One of the core strengths of the QCC-3004 is its low power operation. Battery life is a critical consideration for portable devices, and the QCC-3004 addresses this with its energy-efficient design, which ensures long playback times without frequent recharging. This feature makes it particularly suitable for true wireless earbuds, where space is limited, and battery capacity is often constrained.

The chip’s support for Bluetooth 5.0 ensures stronger connectivity, longer range, and faster data transfer compared to older Bluetooth versions. This enhanced wireless performance provides users with a more stable connection, minimizing the chances of audio dropouts or lag during playback. Whether streaming music, watching videos, or making voice calls, the QCC-3004 ensures smooth and uninterrupted audio.

The QCC-3004’s compact CSP package allows for its integration into small form-factor devices. True wireless earbuds, for example, require tiny components to maximize space for batteries, and the small size of the QCC-3004 makes it an excellent choice for such devices.


规格参数

  • Bluetooth Version: Bluetooth 5.0 with backward compatibility


  • Core Processor: 32-bit low-power CPU for efficient operation


  • Digital Signal Processor (DSP): Integrated DSP for audio enhancements


  • Audio Codecs Supported: SBC, AAC (optional)


  • Memory: Embedded ROM and RAM for fast processing and efficient data access


  • Power Management: Designed with advanced power-saving features to extend battery life


  • Operating Voltage Range: 1.8V to 3.6V


  • Package Type: 68-pin CSP (Chip Scale Package), which makes it ideal for compact designs


  • Wireless Technology: Qualcomm TrueWireless Stereo technology for synchronized dual-channel audio


  • Operating Temperature Range: -40°C to +85°C, making it suitable for a wide range of environmental conditions


  • Low Latency: Optimized for low-latency applications, particularly useful in wireless earphones for video and gaming


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