Bluetooth Audio SoC

QCC-5144-0-CSP90B-MT-01-0

  • The QCC-5144-0 is housed in a CSP (Chip Scale Package) format, specifically CSP90B. This component supports advanced wireless communication standards, making it suitable for applications that require high-speed data transfer and reliable connectivity.It integrates multiple functions within a single chip. This high level of integration helps to reduce the number of external components needed, simplifying design and potentially lowering costs.

Product Description

The Qualcomm QCC-5144-0-CSP90B-TR-01-0 is a high-performance wireless communication component encapsulated in a Chip Scale Package (CSP). The CSP90B package offers a compact and efficient design, which is ideal for applications with space constraints but demanding high performance and functionality.

This component is designed to support advanced wireless standards, making it versatile for a range of applications, including consumer electronics, industrial control systems, and automotive systems. The high level of integration within the QCC-5144-0 reduces the need for multiple external components, simplifying design and potentially reducing costs.

The efficient power management features of the QCC-5144-0 are crucial for battery-powered devices, contributing to longer battery life and better energy efficiency. Its robust performance ensures reliable operation in various environmental conditions, with high signal integrity and minimal interference.


Specification

    • Package Type: CSP (Chip Scale Package)


  • Electrical Characteristics:

    • Operating Voltage Range: The component generally operates within a range of 1.8V to 3.3V. Specific voltage ranges should be verified in the datasheet.

    • Power Consumption: Designed for low power consumption, making it suitable for energy-efficient applications. Exact power consumption details are provided in the datasheet.

    • Frequency Range: Supports specific frequency ranges necessary for its communication functions. Details on frequency capabilities are available in the datasheet.

  • Thermal Characteristics:

    • Thermal Resistance: CSP packages typically offer good thermal performance due to their compact design. The specific thermal resistance should be checked in the datasheet.

    • Operating Temperature Range: Typically operates within a range of -40°C to 85°C, accommodating various environmental conditions.

  • Performance Parameters:

    • Data Rate: Capable of handling high data rates, essential for modern wireless communication applications. The exact data rate specifications are detailed in the datasheet.

    • Signal Integrity: Designed to maintain high signal quality with minimal noise and interference, ensuring reliable communication.

  • Pin Configuration:

    • Pin Count: 90 pins.

    • Pin Functions: Pins are used for various functions including power, ground, input/output, and communication protocols. 


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