Product description
The Qualcomm SMB-1351-0-49CWLNSP-SR-02-0-01 represents a sophisticated solution for modern electronic systems, particularly noted for its ability to maintain high signal integrity. This characteristic ensures that data transmission remains accurate and reliable, which is especially important in high-speed communication scenarios.
In addition to its signal integrity, the module integrates various protection mechanisms that shield it from common electrical issues, such as overcurrent and voltage spikes. This design consideration enhances the module's resilience and contributes to its longevity, making it suitable for use in diverse and demanding environments.
The module's versatility is evident in its compatibility with a broad spectrum of devices and systems, making it a flexible choice for different applications. Its high frequency stability further ensures that it performs consistently across various conditions, while its specific power supply requirements and compact dimensions are tailored to fit seamlessly into various electronic designs.
Overall, the Qualcomm SMB-1351-0-49CWLNSP-SR-02-0-01 excels in maintaining reliable signal performance, incorporating robust protection features, and offering versatility for various electronic applications, all within a compact and well-engineered form factor.
Specification parameters
Frequency Stability: The module offers high frequency stability across a wide range of operational conditions. This stability ensures consistent performance and reliable communication, even in environments with fluctuating temperatures or other external factors.
Power Supply Requirements: It operates with specific power supply requirements, including input voltage and current specifications. Understanding and adhering to these requirements is essential for optimal performance and to prevent potential damage to the module or the host device.
Physical Dimensions: The SMB-1351-0-49CWLNSP-SR-02-0-01 features precise physical dimensions that are crucial for fitting into designated spaces within electronic devices. The compactness of the module allows for integration into designs where space efficiency is a key consideration.
