Product description
The Qualcomm SMB-1356-0-30CWLCSP-TR-05-0-05 is a high-performance module tailored for advanced wireless applications.
Construction and Design: The module features an advanced CWLCSP (Chip-on-Wafer-Large-Contact-Size Package) design, which allows for a high-density interconnection between the chip and the PCB. This packaging technique enhances signal integrity and thermal management, making it suitable for high-speed communication tasks.
Performance Characteristics: It is optimized for applications requiring high data throughput and low latency. The module's design ensures stable and reliable wireless communication by maintaining signal clarity and reducing noise and interference.
Application Versatility: Ideal for use in a range of devices, from consumer electronics like smartphones and tablets to more complex systems such as industrial automation and automotive communication. Its versatile design allows it to adapt to various application requirements and performance needs.
Integration and Usability: The compact form factor of the CWLCSP package facilitates easy integration into tight spaces within electronic devices. The module also comes with comprehensive documentation and support from Qualcomm, assisting engineers in the development and implementation of their designs.
In summary, the Qualcomm SMB-1356-0-30CWLCSP-TR-05-0-05 combines advanced technology with a compact design, offering high-performance wireless capabilities and ease of integration for a variety of applications.
Specification parameters
Frequency Range: Capable of operating across a broad frequency spectrum, making it versatile for different communication standards and applications.
Package Type: Uses a Chip-on-Wafer-Large-Contact-Size Package (CWLCSP), which is known for its high-density interconnects and excellent thermal performance.
Power Requirements: Designed to operate efficiently with specific voltage and current parameters, ensuring stable performance and energy efficiency.
Operating Temperature Range: Rated to function reliably within a specified temperature range, suitable for both consumer and industrial environments.
Dimensions: The compact dimensions of the CWLCSP package make it ideal for integration into small and complex device layouts.
