Product description
The Qualcomm SMB-1358-0-30CWLCSP-TR-05-0-05 is a high-performance semiconductor device used in advanced electronic systems. Its WLCSP package provides a compact and efficient solution for integrating the chip into electronic designs, particularly in scenarios where space is at a premium.
Electrical Characteristics: The chip includes carefully engineered electrical parameters to ensure optimal performance. This includes impedance, capacitance, and signal integrity considerations that are tailored to the needs of the specific application. These parameters are critical for achieving high-speed data transmission and processing.
Thermal Management: Despite its small size, the SMB-1358-0-30CWLCSP-TR-05-0-05 incorporates features to manage heat dissipation effectively. Proper thermal management ensures that the chip remains within safe operating temperatures, thereby maintaining performance and reliability.
Application Integration: The chip is designed to integrate multiple functions into a single package, reducing the need for external components and simplifying the overall design of the electronic system. This integration helps in minimizing board space and improving the overall performance and efficiency of the device.
For the most accurate and detailed information regarding pin configuration, electrical characteristics, and application-specific guidelines, consulting the chip’s datasheet is essential. The datasheet provides comprehensive data necessary for integrating the SMB-1358-0-30CWLCSP-TR-05-0-05 into your electronic designs.
Specification parameters
Package Type: Wafer-Level Chip-Scale Package (WLCSP). This type of package is characterized by its small size and the fact that it is built directly on the wafer before being diced into individual chips. This results in a compact form factor with high pin density.
Pin Count: The SMB-1358-0-30CWLCSP-TR-05-0-05 typically includes a specific number of pins for connectivity, but the exact number can be determined from the component’s datasheet. WLCSP packages generally feature a high pin count in a compact area.
Operating Voltage: The chip operates within a specific voltage range, which must be adhered to for proper functionality. The exact voltage range can be found in the datasheet, but it is designed to be compatible with common voltage levels used in modern electronics.
Temperature Range: The SMB-1358-0-30CWLCSP-TR-05-0-05 is designed to operate reliably within a specified temperature range. This ensures the chip performs well under various environmental conditions, which is crucial for maintaining stability in diverse applications.
Frequency Range: The chip is optimized for specific frequency ranges relevant to its application. The frequency characteristics dictate the chip’s performance in handling high-speed signals or processing tasks.
