Product description
The Qualcomm SMB-1360-0-30DWLNSP-HR-03-0-16 is a state-of-the-art wireless communication module designed to meet the demands of modern connectivity solutions. With its advanced technology, it provides a reliable platform for developers looking to implement wireless features in their products.
The module is engineered for high efficiency, allowing it to operate effectively in environments where power conservation is critical. Its low power consumption makes it ideal for IoT applications, where devices often rely on battery power.
In terms of connectivity, the SMB-1360-0-30DWLNSP-HR-03-0-16 supports a range of wireless protocols, ensuring compatibility with various networks and devices. This flexibility allows developers to create solutions that can communicate seamlessly across different platforms.
The compact design of the module ensures that it can be easily integrated into a wide array of devices, from consumer electronics to industrial systems. Its robust performance and versatile applications make it a preferred choice for engineers and developers aiming to enhance their products with reliable wireless capabilities.
In summary, the Qualcomm SMB-1360-0-30DWLNSP-HR-03-0-16 stands out for its high performance, low power consumption, and versatility, making it an excellent choice for a variety of wireless communication applications.
Specification parameters
Frequency Range: The module operates within a specific frequency range, typically in the sub-GHz or 2.4 GHz bands, depending on the application requirements.
Data Rate: It supports high data rates, allowing for efficient data transmission and communication between devices.
Power Supply: The SMB-1360-0-30DWLNSP-HR-03-0-16 typically requires a specific voltage range for operation, ensuring compatibility with various power sources.
Dimensions: The physical dimensions of the module are compact, facilitating easy integration into various devices and systems.
Interface: It features standard communication interfaces (e.g., UART, SPI, I2C) for seamless integration with microcontrollers and other components.
