Product description
The Qualcomm SMB-1360-0-30DWLNSP-TR-03-0-16 is a versatile component that plays a crucial role in modern electronic systems. It is particularly well-suited for applications in wireless communication, including but not limited to, mobile devices, IoT devices, and networking equipment.
The component's design incorporates advanced materials and technologies that enhance its performance characteristics, such as low insertion loss and high linearity. This makes it ideal for applications requiring high signal integrity and minimal distortion.
In terms of installation, the SMB-1360 is designed for surface mount technology (SMT), allowing for automated assembly processes and reducing manufacturing costs. Its pin configuration is optimized for easy soldering and reliable electrical connections.
Overall, the Qualcomm SMB-1360-0-30DWLNSP-TR-03-0-16 is a high-quality component that meets the rigorous demands of modern electronic applications, providing engineers with a reliable solution for their design needs.
Specification parameters
Operating Frequency: The SMB-1360 operates within a specific frequency range, typically optimized for wireless communication applications.
Power Rating: It has a defined power rating that indicates the maximum power it can handle, ensuring safe and efficient operation.
Impedance: The component features a characteristic impedance that is compatible with standard RF systems, facilitating seamless integration.
Temperature Range: The SMB-1360 is rated for operation over a wide temperature range, making it suitable for both indoor and outdoor applications.
