Charging IC

SMB-1396-0-WLPSP100-TR-02-0-02

  • High Performance: The SMB-1396-0-WLPSP100-TR-02-0-02 is designed to offer excellent performance in wireless communication systems. It ensures reliable signal transmission and reception with minimal interference.
  • Integration Capabilities: This component is engineered to work seamlessly with various wireless protocols and standards, making it versatile for different applications.

产品描述

The Qualcomm SMB-1396-0-WLPSP100-TR-02-0-02 is a state-of-the-art wireless communication module that integrates advanced technology to meet modern connectivity needs. Designed with high-efficiency circuitry, it provides robust performance across various wireless communication protocols. The module is engineered to operate efficiently within a defined frequency range, ensuring precise signal transmission and reception.


Its design emphasizes compactness, making it suitable for integration into space-constrained devices. The SMB-1396-0-WLPSP100-TR-02-0-02 also supports various standard communication interfaces, facilitating its use in a wide range of applications. Its packaging ensures ease of integration and reliability in various operating environments.


This component is particularly valued for its reliability and performance, making it an excellent choice for applications that require consistent and high-quality wireless communication. Its features and specifications make it suitable for use in consumer electronics, IoT devices, and other advanced technology systems.


规格参数

  • Frequency Range: The SMB-1396-0-WLPSP100-TR-02-0-02 operates within a specific frequency range tailored to support the targeted wireless communication standards. This includes detailed frequency ranges for both transmitting and receiving signals.

  • Power Requirements: It typically requires a defined operating voltage and current to function correctly. This includes details on power consumption under different operating conditions.

  • Interface Compatibility: The module supports specific types of interfaces, which might include SPI, I2C, or UART, depending on its application. This ensures it can communicate effectively with other components in the system.

  • Package Type: The component is usually packaged in a specific format such as a surface-mount or through-hole package, impacting how it is mounted on a circuit board.


外观图

相关产品