Product description
The Qualcomm SMB-1396-0-WLPSP100-TR-02-55 is a cutting-edge wireless communication module developed to enhance connectivity in a wide range of applications. It integrates advanced circuitry and design features that support high-efficiency performance, making it ideal for modern wireless systems.
This module operates within a specified frequency range, providing reliable signal transmission and reception that adheres to industry standards. It is designed with a compact form factor, allowing for easy integration into devices with limited space. This makes it suitable for use in compact consumer electronics, IoT devices, and other advanced technology systems where space is at a premium.
The SMB-1396-0-WLPSP100-TR-02-55 is built to handle a variety of communication protocols, offering versatility in different applications. Its power consumption specifications ensure that it operates efficiently, contributing to overall system power savings and extending battery life in portable devices.
In summary, the Qualcomm SMB-1396-0-WLPSP100-TR-02-55 is a high-performance wireless module that combines efficiency, versatility, and reliability. Its advanced features and compact design make it an excellent choice for integrating robust wireless connectivity into modern electronic systems.
Specification parameters
Frequency Range: The module operates within a specific frequency range optimized for its intended wireless communication applications. This ensures effective transmission and reception of signals according to the required standards.
Power Consumption: The SMB-1396-0-WLPSP100-TR-02-55 has defined power requirements, including operating voltage and current consumption. Efficient power management is crucial for ensuring longevity and reducing overall power consumption in battery-operated devices.
Interface Compatibility: This module supports several standard communication interfaces, such as SPI (Serial Peripheral Interface) or UART (Universal Asynchronous Receiver-Transmitter). This facilitates seamless integration with other system components.
Package Type: The module comes in a specific package format, which affects how it is mounted on a circuit board. The packaging is designed for durability and ease of use, ensuring reliable connection and performance.
