Product description
The Qualcomm SMB-1399-0-WLPSP72B-SR-01-0-03 is an advanced wireless communication module developed to provide high-efficiency and reliable connectivity across various applications. This module features state-of-the-art technology that enhances data transfer rates and minimizes latency, making it suitable for demanding communication scenarios.
Designed with a compact form factor, the SMB-1399-0-WLPSP72B-SR-01-0-03 can be integrated into devices with limited space without sacrificing performance. Its broad compatibility with multiple wireless standards and protocols makes it a versatile choice for different applications, from consumer electronics to industrial automation.
The module operates within a specified frequency range, which ensures effective signal transmission and reception. Its power requirements are optimized to balance performance and efficiency, contributing to the overall energy savings in battery-operated devices.
Additionally, the SMB-1399-0-WLPSP72B-SR-01-0-03 is engineered for robustness and reliability, capable of performing consistently even under challenging environmental conditions. Its design and packaging ensure durability and ease of integration into various systems, making it an excellent choice for modern wireless communication needs.
Overall, the Qualcomm SMB-1399-0-WLPSP72B-SR-01-0-03 stands out for its advanced technology, versatile application capabilities, and reliable performance, making it a valuable component in a wide range of wireless communication systems.
Specification parameters
Frequency Range: The module operates within a defined frequency range tailored to its intended wireless communication standards. This ensures effective transmission and reception of signals in the designated frequency bands.
Power Requirements: The SMB-1399-0-WLPSP72B-SR-01-0-03 has specific power requirements, including operating voltage and current consumption. Understanding these requirements is crucial for integrating the module into power-sensitive applications and optimizing overall power efficiency.
Interface Options: It supports multiple communication interfaces, such as SPI (Serial Peripheral Interface) or I2C (Inter-Integrated Circuit), allowing for flexible integration with various system components. This feature ensures that the module can be easily connected to other devices and controllers.
Package Type: The module is available in a specific package format designed for durability and ease of mounting. This format impacts the ease with which the module can be integrated into printed circuit boards (PCBs) and ensures a reliable connection.
