Product description
The Qualcomm SMB-1500-0-WLNSP108D-HR-01-0-02 is a high-performance wireless communication module tailored for modern connectivity needs. At its core, the module leverages Qualcomm’s advanced technology to deliver reliable and high-speed wireless communication. It supports a wide range of wireless protocols, ensuring compatibility with different network standards and enhancing its adaptability to various applications.
The module features a compact design that makes it suitable for integration into space-constrained devices. Its high-efficiency operation is a result of optimized power management, which contributes to longer battery life and reduced energy consumption. This efficiency is particularly valuable in portable and remote sensing applications where battery life is a critical factor.
Furthermore, the Qualcomm SMB-1500-0-WLNSP108D-HR-01-0-02 is engineered for versatility, supporting a broad spectrum of applications from consumer electronics to industrial automation. Its robust design ensures it can withstand varying environmental conditions, making it a reliable choice for diverse operational environments.
In summary, the Qualcomm SMB-1500-0-WLNSP108D-HR-01-0-02 is a state-of-the-art wireless module that combines advanced connectivity, efficient power management, and versatile application support, making it a valuable component for modern electronic systems and IoT solutions.
Specification parameters
Frequency Range: The Qualcomm SMB-1500-0-WLNSP108D-HR-01-0-02 operates within a specific frequency range that ensures compatibility with various wireless networks. For precise frequency details, refer to the manufacturer’s technical datasheet.
Power Output: This module delivers a certain power output level that is optimized for performance and range. The exact power output specifications are essential for understanding its effectiveness in different environments.
Interface Compatibility: The module supports multiple interfaces for integration with other components and systems. Typical interfaces may include UART, SPI, and GPIOs, enabling flexible connectivity options.
Dimensions and Form Factor: The module's physical dimensions and form factor are designed to fit within a compact space, allowing for easy integration into small devices. Specific measurements should be confirmed from the datasheet.
Operating Temperature Range: It operates within a defined temperature range, which ensures reliable performance under various environmental conditions. The temperature range is critical for applications in harsh environments.
