Charging IC

SMB-2351-1-MQFN57-MT-0

  • Compact Form Factor: The device is housed in a compact MQFN57 package. This small form factor is ideal for applications where space is limited, making it suitable for compact electronic devices and systems.
  • Enhanced Connectivity: It is engineered to support enhanced connectivity features, including but not limited to advanced wireless communication protocols. This makes it suitable for integration into devices that require robust and reliable communication capabilities.

Product description

a. Integrated Technology:The SMB-2351-1-MQFN57-MT-0 integrates Qualcomm’s latest semiconductor technology, enabling high-speed data processing and communication. This integration allows the device to support complex algorithms and protocols essential for modern electronic systems.


b. Applications and Use Cases:This component is suited for a variety of applications including mobile devices, consumer electronics, and embedded systems. Its ability to handle advanced communication protocols makes it ideal for use in smartphones, tablets, IoT devices, and other wireless communication systems.


c. Mechanical and Thermal Properties:The MQFN57 package is designed to provide excellent thermal management and mechanical stability. This ensures that the device remains operational under various environmental conditions and contributes to the overall reliability of the electronic system.


d. Connectivity and Integration:The device is designed for easy integration into complex systems. It supports various connectivity options, enabling seamless communication between different system components. Its compact package allows for straightforward integration into tight spaces within electronic assemblies.


In summary, the Qualcomm SMB-2351-1-MQFN57-MT-0 offers high performance in a compact package, with a focus on efficient power consumption and advanced connectivity. Its specifications and features make it a versatile choice for modern electronic applications.


Specification parameters

a. Package Type and Size:

  • Package Type: MQFN57

  • Package Size: The MQFN57 package features 57 pins, and its small footprint allows for efficient use of board space.

b. Frequency and Power Specifications:

  • Frequency Range: Specific frequency ranges and power specifications are optimized to support high-speed and reliable operations. The device is engineered to handle various communication frequencies, making it versatile for different applications.

c. Electrical Characteristics:

  • Voltage Range: The operating voltage range is designed to meet the needs of modern electronic systems, ensuring compatibility with a wide range of power supplies.

  • Current Consumption: The device is optimized for low power consumption, which is crucial for battery-operated and energy-efficient applications.


Product view

Related products