Charging IC

SMB-2351-1-MQFN57-TR-07-0

  • High-Performance Capability: The Qualcomm SMB-2351-1 is designed to deliver high performance for its intended applications, which typically include RF and microwave systems. It provides excellent signal integrity and reliability.
  • Compact Package: It comes in a small, space-efficient MQFN57 package. This compact size helps in saving board space and is ideal for applications where size constraints are critical.

Product Description

The Qualcomm SMB-2351-1-MQFN57-TR-07-0 is a high-performance RF component encapsulated in a MQFN57 package. This package type is notable for its small footprint and efficient thermal management, which are crucial for maintaining performance in compact or high-density designs.


RF Performance: The SMB-2351-1 is designed to deliver superior RF performance, including high linearity and low noise figures, making it suitable for demanding communication applications. Its performance characteristics are optimized for both transmit and receive paths, ensuring signal integrity and minimizing interference.


Thermal Management: Given the small package size, effective heat dissipation is a key design consideration. The MQFN57 package features exposed pads and a well-designed thermal interface to ensure that the component operates within safe temperature limits even under high power conditions.


Application Versatility: The SMB-2351-1 is versatile and can be used in a variety of RF and microwave applications, including but not limited to communication systems, radar, and electronic warfare systems. Its design and packaging allow it to fit into space-constrained environments while delivering high performance.


Integration and Reliability: This component integrates advanced RF technologies and manufacturing techniques to provide reliable operation. The high integration level reduces the need for additional external components, streamlining the design process and enhancing overall system reliability.


For precise operational parameters, detailed electrical characteristics, and specific usage recommendations, it is essential to refer to the component's datasheet provided by Qualcomm.


Specification

  • Package Type: MQFN57 - A 57-pin, quad flat no-lead (QFN) package which is compact and allows for efficient heat dissipation.

  • Operating Frequency: The exact frequency range of the SMB-2351-1 is tailored to specific RF applications, providing precise operation within its designated frequency band.

  • Voltage and Power Requirements: The component operates within a specific voltage range and power requirements, typically defined in the datasheet. Ensure that the power supply matches these specifications to ensure proper functionality.

  • Temperature Range: The component is designed to operate over a wide temperature range, ensuring reliable performance in various environmental conditions.

  • Impedance Matching: The SMB-2351-1 is engineered for optimal impedance matching, which minimizes signal reflections and losses.


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