Product description
The Qualcomm QLN-4642-0-LGA15F-TR-04-0 is engineered to meet the demands of modern wireless communication systems. Its architecture is built on advanced semiconductor technology, which enhances its performance and reliability. The chip integrates multiple functional blocks, including a radio frequency (RF) transceiver, baseband processor, and power management unit, all within a single package. This integration reduces the need for external components, simplifying the design process and lowering overall system costs.
In terms of application, the QLN-4642-0 is ideal for use in smartphones, tablets, IoT devices, and other wireless communication systems. Its ability to handle multiple protocols simultaneously makes it a preferred choice for devices that require seamless connectivity across different networks. The chip's robust security features, including encryption and authentication mechanisms, ensure that data integrity is maintained during transmission, which is critical in today’s data-driven environment.
Moreover, Qualcomm provides comprehensive support and development tools for the QLN-4642-0, including software development kits (SDKs) and reference designs, which facilitate rapid prototyping and deployment. This support is invaluable for manufacturers looking to bring their products to market quickly while ensuring high quality and performance standards.
In summary, the Qualcomm QLN-4642-0-LGA15F-TR-04-0 is a cutting-edge solution for wireless communication, combining high performance, low power consumption, and robust security features in a compact package, making it an excellent choice for a wide range of applications in the ever-evolving tech landscape.
Specification parameters
Frequency Range: The chip operates across a wide frequency range, typically from 2.4 GHz to 5 GHz, accommodating various wireless standards such as Wi-Fi, Bluetooth, and cellular communications.
Data Rate: It supports high data rates, often exceeding 1 Gbps, which is essential for high-bandwidth applications.
Power Consumption: The device is designed for low power operation, with typical consumption figures around 100 mW during active transmission and even lower in standby mode.
Interface: The QLN-4642-0 features multiple interfaces, including SPI (Serial Peripheral Interface) and I2C (Inter-Integrated Circuit), allowing for flexible connectivity options with other components.
Operating Temperature: The chip is rated for a wide operating temperature range, typically from -40°C to +85°C, making it suitable for both consumer and industrial applications.
Size: The LGA package dimensions are compact, usually around 15mm x 15mm, which aids in space-saving designs.
