Product Description
The MediaTek MT6315V is a high-performance PMIC developed to address the power management needs of portable devices. Its design ensures efficient voltage regulation using high-efficiency buck converters and LDOs, delivering stable and reliable power to critical system components such as CPUs, GPUs, and memory. This improves system performance and reduces energy consumption, enabling longer battery life for mobile devices.
The MT6315V excels in battery management with its comprehensive set of protection features. These include over-voltage protection, under-voltage protection, and over-temperature protection, which ensure safe charging and discharging of batteries. The integrated monitoring system provides accurate real-time information about battery status, helping to optimize energy usage and extend battery lifespan.
The IC’s small form factor, achieved through a WLCSP design, makes it an ideal choice for slim and lightweight mobile devices. Despite its compact size, the MT6315V maintains excellent thermal management, effectively dissipating heat during high-load operations such as gaming, multitasking, or video streaming.
System designers benefit from the MT6315V’s flexible integration options. Its support for standard communication protocols like I2C and SPI simplifies connectivity with SoCs and other peripheral components. Additionally, GPIOs allow for customization and expansion of device functionality, enabling manufacturers to create differentiated products.
In summary, the MediaTek MT6315V is a versatile and reliable PMIC that delivers efficient power management, robust battery safety, and compact design. Its advanced features make it a valuable component for powering next-generation mobile devices.
Specification
Voltage Regulation:
High-efficiency buck converters for core and peripheral power needs.
Low-dropout (LDO) regulators for precise voltage control.
Battery Management:
Over-voltage protection (OVP), under-voltage protection (UVP), and over-temperature protection (OTP) for safe operation.
Integrated monitoring for battery status.
Interfaces:
Supports I2C and SPI communication protocols for integration with SoCs and other components.
GPIOs for additional functionality and customization.
Thermal Management:
Efficient heat dissipation for stable operation during high loads.
Physical Package:
WLCSP (Wafer-Level Chip-Scale Package) for compact device integration.
