MediaTek

MT6393DN/BHDG-L

  • Integrated Power Management: The MT6393DN/BHDG-L is designed with advanced power management capabilities, allowing for efficient energy usage in mobile devices, which is crucial for extending battery life.
  • Multi-Channel Support: This chipset supports multiple power output channels, enabling it to manage power distribution effectively across various components of a device, such as the CPU, GPU, and peripherals.
  • Versatile Connectivity Options: The MT6393DN/BHDG-L includes support for various connectivity standards, ensuring compatibility with a wide range of devices and enhancing overall user experience.

Product description

The MediaTek MT6393DN/BHDG-L is a highly integrated power management IC (PMIC) designed specifically for mobile applications, including smartphones and tablets. Its primary function is to manage power distribution efficiently across various components of a device, ensuring optimal performance while maximizing battery life.

One of the standout features of the MT6393DN/BHDG-L is its advanced power management capabilities. The chipset is engineered to handle a wide input voltage range, typically from 3.0V to 5.5V, making it versatile for different battery configurations. This flexibility allows manufacturers to design devices that can operate effectively under various conditions, ensuring that users have a reliable experience regardless of their usage patterns.

The MT6393DN/BHDG-L supports multiple output channels, which is essential for managing power distribution to different components such as the CPU, GPU, and other peripherals. Each output channel can be configured to provide specific voltage levels, allowing for precise power management tailored to the needs of each component. This capability is particularly important in modern mobile devices, where power efficiency is critical for extending battery life and enhancing overall performance.

Efficiency is a key consideration in the design of the MT6393DN/BHDG-L. The chipset boasts high power conversion efficiency, typically exceeding 90%. This means that less energy is wasted as heat, which not only improves battery life but also contributes to the overall thermal management of the device. Integrated thermal management features help prevent overheating, ensuring that the device operates within safe temperature limits even during intensive tasks.

Communication with the main processor is facilitated through an I2C interface, allowing for seamless integration into the device's architecture. This interface enables the PMIC to receive commands and adjust power output dynamically based on the device's operational requirements.

Safety is also a priority in the design of the MT6393DN/BHDG-L. The chipset includes various protection mechanisms, such as over-voltage, under-voltage, over-current, and thermal protection. These features help safeguard the device's components from potential damage due to power fluctuations, ensuring long-term reliability and performance.

In summary, the MediaTek MT6393DN/BHDG-L is a sophisticated power management solution that addresses the growing demands of mobile devices for efficient power distribution and management. Its combination of advanced features, high efficiency, and robust protection mechanisms makes it an excellent choice for manufacturers looking to enhance the performance and reliability of their mobile products. By optimizing power usage, the MT6393DN/BHDG-L contributes to a better user experience, allowing consumers to enjoy their devices for longer periods without the need for frequent recharging.


Specification parameters

  • Power Management IC (PMIC): Integrated PMIC designed for mobile applications

  • Input Voltage Range: Supports a wide input voltage range, typically from 3.0V to 5.5V

  • Output Voltage Regulation: Multiple output voltage options for different components, including adjustable output voltages

  • Efficiency: High efficiency in power conversion, typically above 90%

  • Thermal Management: Integrated thermal management features to prevent overheating

  • Communication Interfaces: I2C interface for communication with the main processor

  • Protection Features: Over-voltage, under-voltage, over-current, and thermal protection mechanisms


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