Network RF Chip

QCN-5054-0-105DRQFN-MT-07-1

  • The QCN-5054-0-105DRQFN-MT-07-1 is a semiconductor device housed in a QFN (Quad Flat No-Lead) package, designed for high-performance electronic applications. The QFN package type is known for its compact size, efficient thermal management, and electrical performance.

Product description

The QCN-5054-0-105DRQFN-MT-07-1 is designed for high-performance electronic applications. The package features a lead frame with no leads extending out from the package, providing a compact footprint and reducing the space required on a PCB. It typically includes an exposed thermal pad on the bottom of the package to enhance heat dissipation. The specific application of the QCN-5054-0-105DRQFN-MT-07-1 can vary, but it is commonly used in advanced electronics: Communication Devices,Consumer Electronics,Automotive Systems,Industrial Controls.


Specification parameters

  • Package Size: The exact dimensions of the QFN package, such as length, width, and height, would be specified in the datasheet.


  • Pin Count: The number of pins in the QFN package can vary; the specific pin count for this model would be detailed in the datasheet.


  • Operating Voltage Range: The voltage range within which the component operates effectively.


  • Current Rating: The maximum current the device can handle.


  • Temperature Range: The operating temperature range to ensure reliable performance.


  • Frequency Range: If applicable, the frequency range within which the component operates effectively.


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