Product description
The QCN-5054-0-105DRQFN-MT-07-1 is designed for high-performance electronic applications. The package features a lead frame with no leads extending out from the package, providing a compact footprint and reducing the space required on a PCB. It typically includes an exposed thermal pad on the bottom of the package to enhance heat dissipation. The specific application of the QCN-5054-0-105DRQFN-MT-07-1 can vary, but it is commonly used in advanced electronics: Communication Devices,Consumer Electronics,Automotive Systems,Industrial Controls.
Specification parameters
Package Size: The exact dimensions of the QFN package, such as length, width, and height, would be specified in the datasheet.
Pin Count: The number of pins in the QFN package can vary; the specific pin count for this model would be detailed in the datasheet.
Operating Voltage Range: The voltage range within which the component operates effectively.
Current Rating: The maximum current the device can handle.
Temperature Range: The operating temperature range to ensure reliable performance.
Frequency Range: If applicable, the frequency range within which the component operates effectively.