Networking Chip

IPQ-6010-0-FCBGA570-TR-00-0

  • Powerful Multi-Core Architecture: The Qualcomm IPQ-6010 is designed with an advanced multi-core architecture that typically incorporates the latest ARM Cortex technology. This setup enables high-performance processing capabilities, allowing the SoC to manage demanding tasks such as 8K video streaming, high-speed gaming, and extensive data processing. With the ability to handle multiple applications simultaneously, the architecture ensures a seamless user experience in both residential and commercial environments.

Product description

The Qualcomm IPQ-6010-0-FCBGA570-TR-00-0 is a state-of-the-art System on Chip (SoC) designed specifically for high-performance networking applications. At its core, the IPQ-6010 utilizes a powerful multi-core architecture, typically featuring the latest ARM Cortex cores, which can achieve clock speeds of up to 2.5 GHz. This processing capability is crucial for efficiently managing a variety of tasks, from streaming ultra-high-definition video to supporting numerous simultaneous connections in high-density environments such as smart homes and offices.

One of the most significant features of the IPQ-6010 is its support for Wi-Fi 6E (802.11ax). By introducing the 6 GHz frequency band, the SoC enables tri-band connectivity that dramatically enhances overall wireless performance. Users benefit from increased bandwidth, reduced latency, and improved connectivity, even in crowded environments. This is particularly advantageous for applications that demand high data rates, such as online gaming and video conferencing. Advanced technologies like MU-MIMO and OFDMA further optimize the performance of the IPQ-6010, allowing multiple devices to connect simultaneously without a decline in performance.

Security is a top priority for the IPQ-6010, which includes advanced protocols like WPA3 to ensure secure wireless communications. This protection is essential as more IoT devices connect to networks, increasing the risk of unauthorized access and data breaches. The SoC’s robust security features ensure that data transmitted over the network remains encrypted and protected, providing users with confidence in their device's security.

In terms of connectivity, the IPQ-6010 features multiple Gigabit Ethernet ports, which facilitate high-speed wired connections that complement its advanced wireless capabilities. This makes the SoC suitable for a variety of applications, ranging from home routers to enterprise-level networking solutions. The support for eMMC and SD card interfaces further provides manufacturers with flexible storage options, allowing for customization based on specific product requirements.

The IPQ-6010 is also designed with energy efficiency in mind, significantly reducing power consumption while maintaining high performance. Its scalable architecture enables easy integration into a wide range of devices, empowering manufacturers to innovate and create solutions that meet modern networking demands. Operating effectively within a wide temperature range of -40°C to 85°C, the IPQ-6010 is suitable for diverse deployment scenarios, including industrial applications.

In summary, the Qualcomm IPQ-6010-0-FCBGA570-TR-00-0 is a powerful and versatile networking solution that combines advanced processing capabilities, Wi-Fi 6E support, robust security features, and extensive connectivity options. It stands out as an excellent choice for manufacturers and consumers looking for reliable and efficient platforms for modern networking applications, positioning it as a leader in the next generation of networking technology.


Specification parameters

  • Processor: Multi-core ARM Cortex architecture (specific cores may vary)

  • Clock Speed: Up to 2.5 GHz, providing robust processing power for demanding applications

  • Memory Support: Up to 4 GB DDR4 RAM for enhanced multitasking capabilities

  • Wireless Standards:

    • Wi-Fi 6E (802.11ax) with tri-band support (2.4 GHz, 5 GHz, and 6 GHz)

  • Ethernet: Multiple Gigabit Ethernet ports for high-speed wired connections

  • Storage Options: Supports eMMC and SD card interfaces for flexible storage solutions

  • Power Consumption: Optimized for low power usage, enhancing overall energy efficiency

  • Operating Temperature Range: -40°C to 85°C, making it suitable for diverse environments

  • Chip Package: FCBGA570, compact design facilitating easy integration into devices


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