Product description
The Qualcomm QPA-4360-0-54LGA-TR-0A-1 is an advanced RF power amplifier designed to meet the high demands of modern communication systems. Here’s an in-depth look at its design, functionality, and potential applications:
Design and Materials: The QPA-4360-0-54LGA-TR-0A-1 utilizes state-of-the-art semiconductor materials and advanced manufacturing processes. These materials and techniques ensure that the amplifier operates efficiently across a broad frequency range and delivers robust performance. The design prioritizes low noise and high linearity, which are crucial for maintaining signal integrity and achieving reliable amplification.
Operational Characteristics: With a frequency range of 1.8 GHz to 2.2 GHz, the QPA-4360-0-54LGA-TR-0A-1 is versatile and suitable for various communication technologies, including 4G LTE and future 5G systems. The amplifier provides a high gain of approximately 28 dB and can deliver up to 30 dBm (1 watt) of output power. This combination of high gain and output power ensures that even weak signals are effectively amplified, enhancing the overall performance of communication networks.
Thermal Management: The amplifier includes advanced thermal management features, with a thermal resistance of about 20°C/W. This capability ensures effective heat dissipation, which is critical for maintaining stable performance and preventing overheating during high-power operation. Effective thermal management helps to extend the amplifier’s operational life and ensure reliable performance.
Integration and Packaging: The 54-pin LGA package provides a compact and efficient solution for integrating the amplifier into electronic systems. This packaging format supports high-density integration, making it ideal for space-constrained designs. The LGA package also facilitates reliable electrical connections, ensuring consistent performance and reducing the risk of connection issues.
Applications: The QPA-4360-0-54LGA-TR-0A-1 is well-suited for use in high-frequency communication applications, including cellular infrastructure, advanced wireless communication systems, and other high-power transmission technologies. Its high output power, low noise figure, and broad frequency range make it suitable for scenarios requiring robust signal strength and superior signal clarity.
Reliability and Durability: Designed to operate reliably under various environmental conditions, the QPA-4360-0-54LGA-TR-0A-1 offers durability and consistent performance over time. Its robust construction ensures that it can withstand high-stress conditions and maintain functionality in challenging environments.
In summary, the Qualcomm QPA-4360-0-54LGA-TR-0A-1 is a high-performance RF power amplifier that combines advanced features with reliable operation. Its broad frequency range, high gain, and effective thermal management make it a valuable component for modern communication systems that demand powerful amplification and superior signal clarity.
Specification parameters
Frequency Range: The amplifier operates within a frequency range of 1.8 GHz to 2.2 GHz. This range is suitable for a variety of communication technologies and applications.
Gain: It provides a high gain of approximately 28 dB. This gain level is essential for amplifying weak input signals to a higher output level, enhancing the overall performance of the communication system.
Output Power: The QPA-4360-0-54LGA-TR-0A-1 can deliver up to 30 dBm (1 watt) of output power. This power output is suitable for applications that require strong signal strength and extended coverage.
Noise Figure: The amplifier features a low noise figure of around 1.5 dB. This ensures minimal additional noise, preserving the quality and clarity of the transmitted signal.
Power Supply Voltage: It operates with a power supply voltage in the range of 5V to 12V. This flexibility allows for various power management configurations and system designs.
Thermal Resistance: The amplifier has a thermal resistance of approximately 20°C/W, which indicates effective heat dissipation capabilities. This helps maintain stable operation and prolong the device’s lifespan.
Package Type: The QPA-4360-0-54LGA-TR-0A-1 is housed in a 54-pin LGA package. This packaging format supports high-density integration and reliable electrical connections while minimizing the PCB footprint.
