Product Description
The Qualcomm QPA-8821-3-11ELGA-TR-02-0 is a high-performance RF power amplifier designed to meet the demands of advanced communication systems. Here’s a detailed look at its design, functionality, and potential applications:
Design and Materials: The QPA-8821-3-11ELGA-TR-02-0 is constructed using high-quality semiconductor materials and advanced manufacturing techniques. These design elements ensure that the amplifier operates efficiently at high frequencies and delivers robust performance. The choice of materials contributes to its low noise figure and high linearity, essential for high-quality signal amplification.
Operational Characteristics: The amplifier's broad frequency range of 3.5 GHz to 4.2 GHz makes it highly versatile, suitable for various communication technologies such as 5G, advanced Wi-Fi systems, and radar applications. Its high gain of approximately 24 dB and output power of up to 35 dBm (3.2 watts) ensure that even weak input signals are amplified to a level suitable for effective transmission.
Thermal Management: Effective thermal management is a critical feature of the QPA-8821-3-11ELGA-TR-02-0. With a thermal resistance of about 18°C/W, the amplifier is designed to dissipate heat efficiently, preventing overheating and maintaining consistent performance. This capability is crucial for ensuring reliability and longevity, particularly under high-power operating conditions.
Integration and Packaging: The 11-pin ELGA package design provides a compact and efficient solution for integrating the amplifier into electronic systems. The ELGA packaging format offers reliable electrical performance while allowing for a smaller footprint on the PCB. This is advantageous for designs where space is limited, such as in portable and compact devices.
Applications: The QPA-8821-3-11ELGA-TR-02-0 is well-suited for high-frequency communication applications. It is ideal for use in 5G base stations, advanced Wi-Fi systems, and radar technologies, where high output power and low noise figure are critical for optimal performance. Its versatility and robust performance make it a valuable component in modern communication infrastructure.
Reliability and Durability: The amplifier is designed to operate reliably under various environmental conditions. Its robust construction ensures durability and consistent performance over time, even in high-stress or challenging environments.
In summary, the Qualcomm QPA-8821-3-11ELGA-TR-02-0 is a high-performance RF power amplifier that combines advanced features with reliable operation. Its wide frequency range, high gain, and effective thermal management make it a valuable choice for modern communication systems requiring robust amplification and signal clarity.
Specification
Frequency Range: The amplifier operates within a frequency range of 3.5 GHz to 4.2 GHz, making it suitable for high-frequency communication systems and applications.
Gain: It provides a high gain of approximately 24 dB. This level of gain is crucial for amplifying weak input signals to a stronger output level, thereby enhancing the overall system performance.
Output Power: The amplifier is capable of delivering up to 35 dBm (3.2 watts) of output power. This substantial power output ensures effective signal transmission over long distances and through challenging conditions.
Noise Figure: The QPA-8821-3-11ELGA-TR-02-0 features a low noise figure of around 2.0 dB. A low noise figure is essential for ensuring that the amplifier adds minimal additional noise to the signal, preserving overall signal quality.
Power Supply Voltage: The device operates with a power supply voltage ranging from 6V to 12V, offering flexibility in power management and integration into various system designs.
Thermal Resistance: The amplifier has a thermal resistance of approximately 18°C/W, which indicates its effective heat dissipation capabilities. This feature helps maintain stable operation and prolong the device’s lifespan.
Package Type: The QPA-8821-3-11ELGA-TR-02-0 is housed in an 11-pin ELGA (Enhanced Land Grid Array) package. This packaging format supports reliable electrical connections and efficient use of space on printed circuit boards (PCBs).
