RF IC

QPM-5577-0-LGA62B+S-SR-02-0

  • Compact and Efficient Design: Housed in a Land Grid Array (LGA) package with 62 pins, the QPM-5577-0 integrates high power density within a compact footprint. This design allows for efficient thermal management and minimizes space requirements on the circuit board, which is crucial for modern telecommunications equipment where space is at a premium.

产品描述

The Qualcomm QPM-5577-0-LGA62B+S-SR-02-0 is a sophisticated power amplifier tailored for high-performance 5G network applications. It combines advanced technological features with a robust design to meet the rigorous demands of modern telecommunications infrastructure.

  1. Design and Construction: The LGA62B package of the QPM-5577-0 is meticulously engineered to provide reliable performance and easy integration. The Land Grid Array configuration ensures stable mechanical and electrical connections, crucial for maintaining signal integrity. The compact design of the package allows for efficient use of space on the circuit board while supporting high-density applications.

  2. Thermal Management: Thermal management is a key feature of the QPM-5577-0. The amplifier incorporates advanced thermal dissipation technologies to handle the heat generated during operation. This ensures that the amplifier operates reliably even at high power levels. Effective thermal management is essential to prevent performance degradation and to extend the lifespan of the device.

  3. Applications: The QPM-5577-0 is ideal for a wide range of 5G applications, including base stations, repeaters, and other critical infrastructure components. Its high output power and gain make it suitable for scenarios requiring substantial signal amplification and extended coverage. The amplifier’s efficiency and thermal management capabilities also make it well-suited for high-density deployments where power consumption and heat generation need to be carefully managed.

  4. Performance Characteristics: The QPM-5577-0’s performance metrics highlight its capability to support demanding 5G environments. Its broad frequency range allows for compatibility with various 5G bands, while its high output power ensures effective signal transmission over long distances. The amplifier’s high gain and excellent linearity contribute to clean, undistorted signal amplification, which is critical for maintaining network quality and reliability.

In summary, the Qualcomm QPM-5577-0-LGA62B+S-SR-02-0 is a high-performance power amplifier that excels in 5G network applications. Its combination of advanced features, compact design, and efficient thermal management makes it an ideal choice for modern telecommunications infrastructure, providing reliable and high-quality signal amplification in demanding environments.


规格参数

  • Frequency Range:

    • Operational Frequency: The QPM-5577-0 operates across a broad frequency range, typically from 2.5 GHz to 4.2 GHz. This extensive range ensures compatibility with various 5G frequency bands, providing flexibility for different network configurations and deployment scenarios.

  • Output Power:

    • Maximum Output Power: The amplifier provides a high output power of approximately 33 dBm. This level of power is crucial for amplifying signals over long distances, ensuring extended coverage and reliable communication in high-density network environments.

  • Efficiency:

    • Power Efficiency: The QPM-5577-0 boasts a high efficiency, often around 45%. This high efficiency reduces power consumption and minimizes heat generation, which is beneficial for operational cost savings and enhancing the device’s longevity.

  • Gain and Linearity:

    • Gain: The amplifier offers a gain of about 32 dB, which is critical for boosting weak signals to a higher, more usable level. High gain ensures that signals remain strong over larger coverage areas.

    • Linearity: The QPM-5577-0 is known for its excellent linearity, which minimizes distortion and maintains the integrity of complex signals. This is essential for delivering high-quality, undistorted signals in 5G networks.

  • Package Type:

    • LGA62B Package: The amplifier is packaged in a Land Grid Array (LGA) format with 62 pins. This packaging provides a stable and reliable connection to the circuit board, and its design supports effective thermal dissipation, which is vital for high-power applications.


外观图

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