Product description
The Qualcomm APQ-8074-1-990BPNSP-TR-06-0 is an advanced system-on-chip (SoC) designed to meet the performance demands of modern mobile and embedded applications. Leveraging Qualcomm’s Krait architecture, this SoC combines high processing power with energy efficiency, making it particularly well-suited for high-end smartphones, tablets, and various consumer electronics.
At the core of the APQ-8074-1 is its quad-core Krait CPU, which can achieve clock speeds of up to 2.3 GHz. This design enables the SoC to handle multiple tasks simultaneously, ensuring that users experience seamless operation even when engaging with resource-intensive applications. The Krait architecture optimizes performance while managing power consumption effectively, which is crucial in mobile devices where battery life is a priority.
The integrated Adreno 330 GPU significantly enhances the graphics capabilities of the APQ-8074-1. With support for resolutions up to 2560 x 1600 pixels, users can enjoy sharp and vibrant visuals in games and media playback. The GPU's design allows for high frame rates and smooth animations, making it ideal for gaming and other graphics-intensive applications. Additionally, its compatibility with various graphics APIs provides developers with the flexibility to create sophisticated applications that take full advantage of the GPU’s power.
Connectivity is a strong aspect of the APQ-8074-1, featuring support for 4G LTE, which allows devices to access high-speed mobile networks. This is essential for activities such as streaming video, gaming, and online browsing. The SoC also includes Wi-Fi (802.11 a/b/g/n) for reliable wireless internet access, enabling users to connect to local networks effortlessly. Bluetooth 4.0 support further enhances connectivity options, allowing seamless pairing with a range of peripherals, including headphones, speakers, and smart devices.
The memory capabilities of the APQ-8074-1 are designed to support DDR3 RAM of up to 3 GB, facilitating efficient multitasking and quick access to applications. This capacity ensures that users can run multiple applications smoothly without experiencing lag or slowdowns. Additionally, the SoC supports both eMMC and SD card interfaces, providing flexible storage options that accommodate various user needs for applications, media, and other data.
Designed for reliability, the APQ-8074-1 operates within an industrial-grade temperature range of -40 °C to +85 °C. This robustness makes it suitable for a wide array of environments, from industrial applications to automotive systems, where consistent performance is crucial.
The 990 BPNSP package type allows for a compact design, which is vital in modern electronics where space is often limited. This packaging solution enables manufacturers to integrate the SoC into diverse devices while maintaining high performance.
In summary, the Qualcomm APQ-8074-1-990BPNSP-TR-06-0 is a powerful and versatile system-on-chip that combines high-performance processing, advanced graphics capabilities, and comprehensive connectivity options. Its design is optimized for a wide range of applications, making it an excellent choice for high-end smartphones, tablets, and embedded systems. With robust specifications and reliable performance, the APQ-8074-1 stands out as a leading solution for developers looking to create innovative products in a competitive technology landscape.
Specification parameters
CPU Architecture: Quad-core Qualcomm Krait
Clock Speed: Up to 2.3 GHz
GPU: Adreno 330
Maximum Display Resolution: 2560 x 1600 pixels
Memory Support: DDR3 RAM (up to 3 GB)
Connectivity:
4G LTE support
Wi-Fi (802.11 a/b/g/n)
Bluetooth 4.0
Storage Options: eMMC and SD card interfaces
Operating Temperature Range: -40 °C to +85 °C (industrial grade)
Package Type: 990 BPNSP (Plastic No-Slump Package)