Product Description
The Qualcomm WCN-7851-1-NSP334-TR-01-0 is a Wi-Fi 6 and Bluetooth 5.0 combo chip designed for mobile devices, such as smartphones, tablets, and laptops. It supports dual-band Wi-Fi with 2x2 MIMO, which provides faster and more reliable connections. The chip also supports the latest WPA3 security protocol, ensuring secure connections.
The WCN-7851-1-NSP334-TR-01-0 is designed to work with Qualcomm's QCA6391 and QCA6491 Wi-Fi/BT combo chips, which provide a complete Wi-Fi and Bluetooth solution for mobile devices. The chip also supports Qualcomm's Wi-Fi 6-based Wi-Fi SON technology, which enables self-organizing networks that can automatically optimize Wi-Fi performance.
In terms of power consumption, the WCN-7851-1-NSP334-TR-01-0 operates at a voltage range of 2.5V to 3.6V, making it suitable for battery-powered devices. The chip is also designed to be compact, with a package size of 6.5mm x 6.5mm x 0.8mm, making it suitable for use in small form factor devices.
Overall, the Qualcomm WCN-7851-1-NSP334-TR-01-0 is a high-performance Wi-Fi 6 and Bluetooth 5.0 combo chip that provides fast, reliable, and secure connections for mobile devices.
Specification
Part Number: WCN-7851-1-NSP334-TR-01-0
Package Type: TFBGA (Thin Fine-Pitch Ball Grid Array)
Package Size: 6.5mm x 6.5mm x 0.8mm
Operating Temperature: -40°C to 85°C
Storage Temperature: -40°C to 125°C
Wi-Fi Frequency Bands: 2.4GHz and 5GHz
Bluetooth Frequency Band: 2.4GHz
Wi-Fi Data Rates: up to 1.9 Gbps
Bluetooth Data Rates: up to 2 Mbps
Power Consumption: 2.5V to 3.6V
