Qualcomm® RB3 Gen 2 development kit has advanced features and powerful performance, including powerful AI computing, 12 TOPS computing power and computer graphics processing capabilities, to easily create a wide range of iot solutions covering robotics, enterprise, industrial and automation scenarios.
Qualcomm® RB3 Gen 2 development kit supports Qualcomm® Linux®, a comprehensive operating system, software, tools and documentation package designed specifically for Qualcomm Technologies iot platforms.
Based on the Qualcomm® QCS6490 platform, the Qualcomm® RB3 Gen 2 development Kit provides developers with significantly enhanced AI processing power, higher reasoning times per second, increased energy efficiency, and the ability to run more networks simultaneously than previous generations. Machine learning on the device, combined with edge computing, can process large amounts of data in near real time.
The platform includes development kits and software. Developers can choose the version of the development kit that best meets their needs and design iot products that require advanced performance. The platform also includes an SDK that makes it easy for developers to use and integrate application processes and services. The hardware development kit also complies with the 96Boards open hardware specification and supports a range of sandwich board extensions based on Vision Mezzanine.
The platform includes a Qualcomm® Spectra™ ISP 570L image processing engine that delivers the ultimate photography and videography experience, with a main camera and a tracking camera on the vision suite. It can connect and process the output of other cameras, such as stereo cameras, depth cameras, and ToF cameras. The Qualcomm® Adreno™ 633 VPU provides high-quality UltraHD video encoding and decoding, while the Adreno 1075 DPU supports in-device and external UltraHD display.
Multi-gigabit Wi-Fi 6E enables extremely fast wireless connections and low latency. Our Wi-Fi 6E products leverage advanced features such as Qualcomm® 4K Quadrature amplitude modulation (QAM) and support high-speed 160MHz channels to achieve gigabits per second speeds with superior stability and a consistent experience.
Using Qualcomm® Kryo™ 670 cpus and Qualcomm® Hexagon™ processors with converged AI accelerator architecture, the solution delivers powerful connectivity and compute performance and is designed for industrial and commercial iot applications, such as ruggedised handhelds and tablets. Human-machine interface systems, POS systems, drones, kiosks, edge computing boxes, and connected cameras.
FAQ：
Q1: What iot scenarios is the Qualcomm ® RB3 2nd Generation Development Kit suitable for?
A1: Suitable for diverse iot scenarios such as robotics, commerce, and industrial automation.
Q2: What are the core technical advantages of Qualcomm ® RB3 2nd generation development Kit?
A2: Includes 12 TOPS high computing power, advanced image processing capabilities, AI technical support, multi-gigabit Wi-Fi 6E connectivity, Bluetooth® 5.2 and LE audio.
Q3: What types of cameras does the Qualcomm ® RB3 2nd generation Development Kit support?
A3: Supports the main camera, tracking camera, and can handle the output of other cameras such as stereo cameras, depth cameras, and ToF cameras.
Q4: What extended support does the Qualcomm ® RB3 2nd Generation Development Kit provide?
A4: Provides low-speed extensions such as GPIO, I2C, SPI, UART, and audio, as well as high-speed extensions such as PCIe, USB, MIPI CSI/DSI, and SDIO.
Q5: How can developers use the Qualcomm ® RB3 2nd generation Development Kit for application development?
A5: Developers can easily integrate applications and services with a variety of software development kits (SDKS) and tools, including Qualcomm® Neural Processing SDK, Qualcomm® Intelligent Multimedia Product SDK, and more.
►Scene application diagram
►Product physical drawing
►Display Board Photo
►Solution block diagram
►Core technology advantage
• 12 TOPS high computing power and offers comprehensive demo applications and tutorials to accelerate the development of iot applications
• Advanced ISPs provide a single or multiple concurrent camera experience with superior image and video capture capabilities
• AI-enabled workspace security and visualization
• Ultra-fast wireless connectivity and low latency thanks to multi-gigabit Wi-Fi 6E: up to 3.6Gbps, 160MHz, 4K QAM, DBS with MU-MIMO and OFDMA, and WPA3-P&E
Bluetooth® 5.2 and LE audio for clear sound quality, low latency, high reliability, and extended coverage
• Low speed extensions support GPIO, I2C, SPI, UART, and/or audio
• High-speed expansion supports PCIe, USB, MIPI CSI/DSI and/or SDIO, designed for 96Boards midboards
• Supports multiple software development kits (SDKS) and tools, These include the Qualcomm® Neural Processing SDK for Artificial Intelligence, Qualcomm® Intelligent Multimedia Product SDK, Qualcomm® Intelligent Robotics Product SDK, Qualcomm® Hexagon™ DSP SDK, and several Linux distributions
►Scheme specification
Wafer： QCS6490 CPU： Octa-core CPU RAM： uMCP package (6 GB LPDDR4x) Camera：2x C-PHY/D-PHY 30-pin expansion ports on interposer board 1x IMX577 D-PHY 12 MP, 1x OV9282 D-PHY 1 MP with bracket, plus additional D-PHY and GMSL-capable expansion ports GPU General purpose processor： Adreno 643 GPU Video：Adreno 633 VPU: 4K60 fps decode / 4K30 fps encode Reveal：Up to two displays supported concurrently: Full-size HDMI connector, USB Type-C supporting DP alt mode, mini-DP connector, DSI expansion AI：12 TOPS WLAN/Bluetooth：802.11ax with DBS, Bluetooth 5.2, two onboard printed antennas, RF expansion connectors for optional external antennas Memory：uMCP package (128 GB UFS Flash) 1x MicroSD Card Slot, PCIe expansion for NVMe PCIe ：1x PCIe Gen 3 2-lane to expansion connector, optional 1x PCIe Gen 3 1-lane to expansion connector USB：1x USB 3.0 Type-C, 1xUSB 2.0 w/OTG, 2x USB 3.0 Type-A, 1x USB 3.0 on high-speed expansion Audio：1x DMIC, 2x digital audio amplifiers, I2S/Soundwire/DMIC expansion on low-speed connectors 4x DMIC, 2x digital audio amplifiers, I2S/Soundwire/DMIC expansion on low-speed connectors Sensor：IMU onboard (ICM-42688), additional expansion IMU (ICM-42688), Pressure sensor (ICP-10111), Mag sensor/compass(AK09915), additional expansion
