2024.12.04

MediaTek MT6190M 5G RF System Datasheet

MediaTek MT6190M is a multimode, multiband, and highly integrated transceiver with a 12 nm FinFET CMOS. MT6190M RF system data sheets describe the performance goals for RF standalone chips to be embedded throughout the platform.

directory 1 Introduction 1.1 Overview 1.2 Main features 2 Block Diagram and Application Diagram 3 General Specifications 3.1 Packaging 3.2 Ordering Information and IC Marking 3.3 MT6190M I/O List 3.4 Ball Distribution 3.5 Absolute Maximum Ratings 3.6 Operating Conditions 4 Supply Specifications 4.1 External Power Supplies and Interfaces 5 Transmitters 5.1 TX Block Diagram 5.2 NR/4G FDD/TDD transmit chain performance specification 5.3 3G FDD Transmit Chain Performance Indicators 5.4 3G TDD Transmitter Chain Performance Specification 5.5 3G C2K Transmit Chain Performance Specification 5.6 2G Transmit Chain Performance Specification 5.7 MRx Performance Specifications 6 RF receiver 6.1 TD-SCDMA Acceptance Specifications 6.2 GGE (2G GSM/GPRS/EDGE) receive specifications 6.3 CDMA Acceptance Specifications 6.4 WCDMA Reception Specification 6.5 LTE Reception Specifications 6.6 NR RX Specifications 7 digital control interfaces 7.1 Introduction 7.2 Power-on reset 7.3 Digital Mode of Operation 8 Refer to the clock specification 8.1 Reference Input Buffer Specification (CLK26M) 8.2 26 MHz Clock Specification Appendix 1 Terms and Conditions Figure 2-1 RFSYS block diagram Figure 3-1 Globe Diagram Figure 5-1 TX Block Diagram (TX0) Figure 6-1 Receiving Block DiagramMT6190M Block diagram and application diagram

SerDes interface model Use the provided SerDes IBIS model to represent this high-speed interface. The following table summarizes the PCB trace requirements for the SerDes interface between the RF and AP chips.

Routing guideline
AP chip
RF chip
Impedance
Differential
75~100 ohm (including ±10%), typical case  Suggestion: 85±10% ohm or 90±10% ohm
Single end
37.5~50 ohm (including ±10%), typical case  example Suggestion: 42.5±10% ohm or 45±10% ohm
Lane skew
Intra
≤ 1 ps (≈6 mil@FR4 material)
Inter
≤ 160 ps (≈960 mil@FR4 material) (data to clock  in UL and DL respectively)
Lane sensitivity
To  other lanes
≥ 3 x W (inner layer)
    [Exception] ≥ 2W under chip fanout area (inner layer)
To other traces
≥ 4 x W (inner layer with GND trace)
    [Exception] ≥ 3W under chip fanout area (inner layer with GND trace)
ESD interference
Place GND trace with high density GND via;  route in inner layer Adjacent vertical layers with SerDes routing must be  full GND plane.
Routing layer
Must be the same for all lanes.
Loss budget
≤ 4 dB@6 GHz (typical length ≤ 8 cm@2.5 mil  trace width)
Lane via
Quantity  (max.)
x3 (x2 buried + x1 blind)
    Reserve GND via adjacent to lane via to optimize the return path.
Type/Size
Buried: 100/23 0um; blind: 250/450 um
Stub
No
Power
AVDD12_DRF
Power  inductance: < 1 nH (ball to 1st cap)
    External capacitor: 1 nF + 100 nF
    - Distance between ball and  cap ≤ 100 mil
    - Power trace width ≥  15 mil
    - No power via  between ball and cap
Power  inductance: < 1 nH (ball to 1st cap)
    External capacitor: 1 nF + 100 nF
    - Distance between ball and  cap ≤ 100 mil
    - Power trace width ≥  20 mil
    - No power via  between ball and cap
AVDD18_DRF
Power  inductance: < 1 nH (ball to 1st cap)
    External capacitor: 100 nF
    - Distance between ball and  cap ≤ 100 mil
    - Power trace width ≥  20 mil
    - No power via  between ball and cap
Power  inductance: < 1 nH (ball to 1st cap)
    External capacitor: 100 nF
    - Distance between ball and  cap ≤ 100 mil
    - Power trace width ≥  20 mil
    - No power via  between ball and cap


MT6190M IC Mark
MT6190M IC标记

External power supply and interface MT6190M Powered by seven power sources.

Supply  name
Usage
Regulator type
Output voltage
VRF18
LDO  supply (from system DCDC) for all major sub- systems, interface and register  retention
Linear  with ripple
1.8V
VRF13
DCDC  supply for all major sub- systems
Linear  with ripple
1.3V
VRF09
DCDC  supply for all major sub- systems
Linear  with ripple
0.9V
VIO18
LDO  supply (from system DCDC) for all major sub- systems
Linear  with ripple
1.8V
VIO12
LDO  supply (from system DCDC) for all major sub- systems
Linear  with ripple
1.2V
DVDD_DRF
DCDC  supply for all major sub- systems
Linear  with ripple
0.7V
DVDD_MEM
LDO  supply (from system DCDC) for all major sub- systems
Linear  with ripple
0.85V

MT6190M 电源引脚


TX block diagram MT6190M contains two separate emitters, TX0 and TX1, to support both CA and MIMO situations. The following diagram is a block diagram (TX0). The LB/MHB/CB block is the same between TX0 and TX1, except that TX1 does not support 2G.
TX框图(TX0)