MediaTek MT6877 (Dimensity 900) 5G chip datasheet | Edal Tech International Limited

2024.12.04

MediaTek MT6877 (Dimensity 900) 5G chip datasheet

Technical Blog

With integrated Bluetooth, FM, WLAN, and GPS modules, the MediaTek MT6877 (see Figure 1-1) is a highly integrated baseband platform that combines a modem and application processing subsystem to support LTE/5G/NR and C2K smartphone applications. The chip integrates two Arm® Cortex-A78 cores running at up to 2.4 GHz, six Arm® Cortex-A55 cores running at up to 2.0 GHz, and a powerful multi-standard video codec. In addition, an extensive set of interfaces and connectivity peripherals for connecting cameras, touchscreen displays, and UFS/MMC/SD cards are included. The application processors are multi-core Arm® Cortex-A78, Arm® Cortex-A55 with NEON engine, providing the processing power needed to support the latest OpenOS and its demanding applications such as web browsing, email, GPS navigation, and gaming. All of this can be viewed on a high-resolution touchscreen display and enhanced with 2D and 3D graphics acceleration. Multi-standard video accelerators and advanced audio subsystems are also integrated to provide advanced multimedia applications and services, such as streaming audio and video, a large number of decoders and encoders. The combination of high-performance CPU, DSP, and hardware coprocessors provides a robust modem subsystem capable of supporting NR Sub6, LTE Cat 18, Category 24 HSDPA downlink, and Category 7 HSUPA uplink data rates, as well as Category 12 GPRS, EDGE. The MT6877 hardware also embodies Wireless Communication devices, including WLAN, Bluetooth, and GPS. The MT6877 hardware integrates four advanced radio technologies into a single chip, providing the industry's best and most convenient connectivity solution.

Simultaneous transmission of voice, data, and audio/video on mobile phones and media tablets improves overall quality. The small size and low power consumption greatly reduce PCB layout resources.

Outstanding features integrated in the MT6877 hardware • 2 Arm® Cortex-A78 cores operating at 2.4 GHz • 6 Arm® Cortex-A55 cores operating at 2.0 GHz • LPDDR5 up to 16 GB (2 channels, 16-bit data bus width) • Memory clocks up to LPDDR4X-4266/LPDDR5-5500 • LTE cat-4 with 4x18 MIMO • NR Sub6 2CC with 120 MHz aggregate bandwidth • Embedded connectivity systems, including WLAN/BT/FM/GPS • Up to FHD+ resolution (1,080 x 2,520) • OpenGLES 3.2 3D graphics accelerator • ISP supports 32 MP@30fps • HEVC 4K@30 fps decoder • HEVC 4K@30 fps encoder

• Voice codecs (FR, HR, EFR, AMR FR, AMRHR and wideband AMR and EVS_WB)

Figure 1-1. Advanced MT6877 functional block diagram 1.2 Platform Features •routine − Smartphones, 2 MCU subsystem architectures − Support eMMC/UFS boot − Support LPDDR4X/LPDDR5 • AP MCU subsystem − 2 x Arm® 2.4 GHz Cortex-A78 cores, each with 64 KB L1 I-cache, 64 KB L1 D-cache, and 256 KB L2 cache − 6 Arm® 2.0 GHz Cortex-A55 cores, each with 32 KB L1 I-cache, 32 KB L1 D-cache, and 128 KB L2 cache − Shared 2 MB L3 cache − NEON multimedia processing engine with SIMDv2/VFPv4ISA support − DVFS technology, adaptive large cluster core voltage from 0.55V to 1.05V, small cluster core voltage from 0.55V to 1.0V • Programmable Vision Processor Unit (VPU) with AI and CV support − Optimal performance: Fix 8: up to 426 GMAC; Fix 16: Up to 106 GMAC − Dual-core supports multiple applications at the same time • Artificial Intelligence Accelerator (AIA) (Deep Learning Accelerator: DLA) to support computationally demanding neural network applications − Top performance: Fix8 901 GMAC, Fix16 451 GMAC, FP16 451 GMAC − Synchronous pipeline hardware function blocks (CONV/ACT/POOL/EWE/BILINEAR) − Support for Android NNa symmetric quantization data format − Support for compressing weights to reduce DRAM BW − Support for sequential models • MD MCU subsystem − High-performance multi-core and multi-threaded processor architecture − High-performance AXI bus interface − Generic DMA engine and dedicated DMA channel for peripheral data transfer − Power management for clock gating control • MD external interface − Dual SIM/USIM interfaces − Interface pins to RF and radio-related peripherals (antenna tuners, PAs, etc.). •security

− Arm® TrustZone®Security

• External memory interface − LPDDR4X/LPDDR5 up to 16 GB (2 lanes, 16-bit data bus width) − Memory clocks up to LPDDR4X-4266/LPDDR5-5500 − Self-refresh/partially self-refresh mode − Low-power operation − Programmable slew rate of memory controller I/O pads − Dual column memory devices − Advanced bandwidth quorum control •peripheral device − USB 1 port with USB3.0 device mode or USB2.0 OTG mode − UFS 3.1 − 2 UARTs for debugging and application − 8 SPI Masters for external devices − 8 I2C and 5 I3C for control peripherals such as CMOS image sensors, LCM or FM receiver modules -Utmost. 4 PWM channels (depending on system configuration and I/O usage) − I2S for connecting an optional external high-end audio codec − GPIO − 1 set of memory card controller supporting SD/SDHC/MS/MSPRO/MMC and SDIO2.0/3.0p • Operating conditions − Core voltage: 0.55~0.725V − I/O voltage: 1.8V/2.8V/3.3V − Memory: 0.8V − LCM interface: 1.8V − Clock source: 26 MHz, 32.768 kHz •parcel − Type: VFBGA − 12.4 mm* 12.4 mm - Height: Max. 0.9 mm − Balls: 1,033 goals

− Ball spacing: 0.35 mm

1.3 Modem Characteristics • NR− 3GPP EN-DC option 3/3a/3x − 3GPP SA Option 2 − FDD/TDD up to 2.77 Gbps downlink, 1.25 Gbps uplink − Support 5~100MHz RF bandwidth per component carrier (CC). − Supports carrier aggregation (CA) up to 2CC with an aggregate bandwidth of 120 MHz − Supports SCS 15/30 kHz − Supports downlink/uplink 256 QAM − Supports downlink 4x4 MIMO and uplink 2x2 MIMO • LTE − FDD/TDD up to 1.2 Gbps downlink, 150 Mbps Uplink − Downlink Carrier Aggregation (CA) Capability; Each component carrier (CC) has 1.4~20 MHz RF bandwidth and up to 4 CC − Upband in-carrier aggregation (CA) capability; Each component carrier (CC) has 1.4~20 MHz RF bandwidth and up to 2 CC − Support 256 QAM downlink/64 QAM uplink − 4x2 downlink SU-MIMO per component carrier − Downlink MU-MIMO for each component carrier − Support for MBMS − Uplink CoMP capability − Advanced interference cancellation ▪ PDCCHpIRC ▪ CRS-based PDSCH ▪ DMRS-based Co-UE − Selection of transmitting antennas • 3GUMTS FDD SUPPORTED FEATURES − 3Gmodem supports most of the major features in 3GPP Release 7 and Release 8 − CPC (DTX in CELL_DCH,UL DRX DL DRX),HS SCCH-less,HS-DSCH − Dual-battery operation − MAC-ehs − 2 DRX (Receiver Diversity) schemes in URA_PCH and CELL_PCH − Uplink cats. 7 (16 QAM) with a throughput of up to 11.5 Mbps

− Downlink cats. 24 (64 QAM, dual-unit HSDPA) with up to 42.2 Mbps throughput

− Rapid hibernation − ETWS − Network selection enhancements − Selection of transmitting antennas • Radio interface and baseband front-end − High dynamic range delta-sigmaADC converts downlink analog I and Q signals to digital baseband. − 10-bit D/A converter for automatic power control (APC). − Programmable radio reception filter with adaptive gain control − Dedicated Rx filter for FB acquisition − Baseband Parallel Interface (BPI) with Programmable Drive Strength − Multi-band support • GSM modem and voice codec − Dial tone generation − Noise reduction − Reduced advanced sidetone oscillation − Digital sidetone generator with programmable gain − 2 programmable acoustic compensation filters − GSM quad vocoder for Adaptive Multi-Rate (AMR), Enhanced Full Rate (EFR), Full Rate (FR), and Half Rate (HR). − GSM channel coding, equalization and A5/1, A5/2 and A5/3 encryption − GPRS GEA2 and GEA3 encryption − Programmable GSM/GPRS/EDGE modem − Packet-switched data using CS1/CS2/CS3/CS4 coding schemes − GSM circuit switching data − GPRS/EDGE Class 12 − Support for SAIC (Single Antenna Interference Cancellation) technology − VAMOS (Speech Service over Adaptive Multi-User Channel) technology in the R9 specification − Selection of transmitting antennas − RF dual-antenna reception • CDMA2000 modem interface − Support for CDMA20001xRTT (version 0) and CDMA2000 HRPD/1xEV-DORevision0 and A − Supports a maximum data rate of 1x 153.6 kbps for forward and reverse links and a DO data rate of 1.8 Mbps for forward links and 3.1 Mbps for reverse links − Hybrid operation between 1x and HRPD − Support for 1x diversity − Support for SRLTE

− Selection of transmitting antennas

1.4 Connection Function The MT6877 hardware includes four wireless connectivity features: Wi-Fi Bluetooth global positioning system FM receiver The RF part of these four modules is placed on the chip MT6635. Integrating four advanced radio technologies on a single chip, the MT6877/MT6635 is the industry's best and most convenient connectivity solution, enabling advanced and sophisticated radio presence algorithms and hardware mechanisms. It supports dual (MT2.4) antenna sharing between 2.4 GHz Bluetooth, 2.4 GHz/5 GHz WLAN, and 1.575 GHz GPS. Simultaneous voice, data, and audio/video transmission on mobile phones and media tablets improves overall quality. The small footprint and low power consumption greatly reduce PCB layout resources. • Supports integrated Wi-Fi/Bluetooth/GPS − WLAN dual antennas − Single/dual antennas for WLAN/GPS/Bluetooth − Self-calibration − Individual TCXO and TMS for GPS, BT and WLAN − Best-in-class current consumption performance

− Intelligent BT/WLAN coexistence schemes that go beyond PTA signaling (e.g., considering the transmission window and duration of protocol switching sequences, frequencies, etc.)

• Wi-Fi − Dual-band (2.4/5GHz) 2-stream 802.11 ax/ac/a/b/g/nMAC/BB/RF SoC, 20/40/80 MHz bandwidth, MCS0~11(1,024-QAM) − 802.11 d/e/h/i/j/k/r/v compatible − Security: WFA WPA/WPA2personal, AES-CCMP, WPI-SMS4, GCMP, WPS2.0, WAPI (hardware) − QoS:WFA WMM,WMM PS − 802.11n optional features: STBC, A-MPDU, Blk-Ack, RIFS, MCS feedback, 20/40 MHz coexistence (PCO), unscheduled PSMP − Support for 802.11wprotected managed frames − Support for 802.11axSTBC Tx/Rx, 4T2R beamformer, 2T2R beamformer, MU-MIMO Rx, WoWLAN − Supports MediaTek's proprietary low-power green AP mode for portable hotspot operation − Automatic rate control to optimize signal range and performance − Wi-Fi Direct (WFA P-2-P standard) and Wi-Fi Miracast (Wi-Fi display) support − Wi-Fi HotSpot 2.0 support − Integrated PA with 2.4Gmax. CCK and 5Gmax have a power of 23 dBm. 54 mbpsOFDM power is 19 dBm. − 2.4GRx sensitivity of -76.5 dBm for 11nHT20 MCS7; The 11ac VHT80 MCS9 has a 5GRx sensitivity of -63 dBm − Support for 32 multicast address filters and TCP/UDP/IP checksum offload − Tx power control per pack •Bluetooth − Bluetooth 2 dual mode with LE 5 Mbps, LE long range and advertising extensions − Support BT 5.1 AoA/AoD function − Support BT 5.2 synchronous channel function and the following specifications. authentication − Integrated PA with 14 dBm (Class 1) transmit power.

− Receiver Sensitivity @ Chip Input:

▪ GFSK -97 dBm

▪ DQPSK -96 dBm
▪ 8-DPSK -90 dBm
▪ BLE_1M -100 dBm
▪ BLE_2M -97 dBm
▪ BLE_500K -102 dBm(PER <30.8%)
▪ BLE_125K -106 dBm(PER <30.8%)
− Support BT/Wi-Fi/LTE/NR coexistence − Supports 7 BT links and 16 BLE links − Support Packet Loss Concealment (PLC) function to improve voice quality − Wideband voice support − Support for mSBCs and SBCs, including mono and stereo − Supports secure connections to AES128 and ECC256 − Adaptive frequency hopping with built-in channel evaluation method •global positioning system − Support for L1 GPS/GLONASS/BeiDou/Galileo/QZSS are received simultaneously ▪ GPS/Galileo only (GPS only) ▪ GPS/Galileo-GLONASS (G+G) ▪ GPS/BeiDou (G+B) ▪ GPS/GLONASS/BeiDou(G+G+B) ▪ GPS/Galileo/GLONASS (G+G+G) ▪ GPS/Galileo/GLONASS/BeiDou(G+G+G+B) - Support for SBAS (Satellite-Based Augmentation System): WAAS/MSAS/EGNOS/GAGAN − Support L5 GPS/BeiDou-IIIB2A/Galileo-E5a/NavIC concurrent reception − Best-in-class sensitivity performance ▪ -165 dBm tracking sensitivity ▪ -163 dBmhotstart sensitivity ▪ -148 dBm cold-start sensitivity ▪ -151 dBmwarMstart sensitivity − AGPS sensitivity ▪ Rough time assistance is 8 dB design margin that exceeds the 3 GPP minimum. ▪ Finetime assistance is a design margin of 10 dB that exceeds the minimum requirement of 3 GPP. − Full A-GPS function (E911/SUPL/EPO/HotStill) − Active interference cancellation of up to 12 in-band tones in the L1 and L5 bands − Support for both TCXO and TMS (Thermistor Crystal) clock sources

− 5 Hz update rate

•frequency modulation − 65~108 MHz in 50 kHz steps − RDS/RBDS − Digital stereo demodulators − Simplified Digital Audio Interface (I2S) − Stereo noise reduction − Audio sensitivity 2 dBμVemf (SINAD =26 dB) − Audio SINAD 60 dB − Interference mitigation • WBTIPD − Integrated matching network, balanced bandpass filter, GPS-WBT duplexer − Fully integrated in the oneIPD chip − Single- and dual-antenna operation • GPS IPD − Integrated high-pass type matching network and fifth-order elliptical low-pass filter − Fully integrated in the oneIPD chip − Single- and dual-antenna operation 1.5 Multimedia Functions •show − Portrait panel resolution up to FHD+21:9 (1,080 * 2,520) and frame rate up to 120 Hz − MIPIDSI interface (4 data lanes) − MiraVisionTM for image quality enhancement − Embedded LCD gamma correction − True color − 6 overlays, alpha channels per pixel and gamma table − Spatial and temporal jitter − Side-by-side format output to stereoscopic 3D panels in portrait and landscape mode − Color enhancement − Adaptive contrast enhancement − Image/video/graphic clarity enhancement − Dynamic backlight scaling − Support for GPUdecoder (AFBC)

− Support DSC V1.2 data compression to DSI

•graphics − Each core is capable of processing 2M pixels per MHz and 4M texels per MHz for bilinear texels per MHz − OpenGLES 3.2/3.1/3.0/2.0/1.1 − Vulkan 1.1/1.0 − OpenCL2.2 •Image − Electronic image stabilization − Video stabilization − Preferred color adjustments − Noise reduction − Multi-frame noise reduction for image capture − Multi-scale noise reduction for single/multi-frame image capture − Time noise reduction for video recording − Anti-smudge correction − Lens shading correction − Automatic sensor defect pixel correction − Support auto exposure/auto white balance/auto focus − Edge enhancement (sharpness) − Deep learning face detection − Video beautification − Zero-shutter delay image capture − Support for high frame rate sensor (16MP + 4MP/30 fps) − 3 MIPICSI-2 high-speed camera serial interfaces; Utmost. 4 D-DMY data channels; Maximum. 3 C-PHY trios − Supports up to 3 C-PHY 3 Gsps trios − Dual camera, [20 MP + 20 MP] @30fps − Throughput can withstand SMVRHD240sensor readout − YUV framebuffer compression to reduce DRAM BW requirements − Hardware JPEGencoder: 400M pixels/sec baseline encoding. − Support YUV422/YUV420 color format and EXIF/JFIF format

− BaselineJPEG decoding throughput

@YUV420, ≥64M pixels: 246M pixels/sec. − Dual cam real-time depth •Video − HEVC decoder 4K2K@30 fps/100Mbps − VP9 decoder 4K2K@30 fps/100 Mbps − H.264 decoder: Baseline4K2K@30 fps/100 Mbps − H.264 decoder: Main/high profile4K2K@30 fps/100 Mbps − Sorenson H.263/H.263 decoder: 1,080p@60 fps/60 Mbps − MPEG-4 SP/ASP decoder: 1,080p@60fps/60 Mbps − VP8 decoder 1,080p@60fps/40 Mbps − HEIF decoder: maximum resolution 16,383 * 16,383 − MPEG-4 encoder: 720 * 480@30 fps, 4 Mbps. Level 6 for Simple Configuration and Level 5 for Advanced Simple Configuration − H.263 encoder: 640 x 480@30 fps, 4 Mbps. Profile0 − H.264 encoder: 8-bithigh profile4K2K@30 fps, 100 Mbps − HEVC encoder: 8-bitmain profile4K2K@30 fps, 100 Mbps − HEIF encoder: maximum resolution 16,383 * 16,383 •sound − Supported Audio Content Sample Rates: 8~192 kHz (I2S output up to 384 kHz) − Supported audio content sampling formats: 8-bit/16-bit/24-bit, mono/stereo (up to 32-bit for I2S)

− Supported interfaces: I2S, PCM

− External codec I2S interface supports 16-bit/24-bit/32-bit, mono/stereo, 8~384kHz. − 4-band IIR compensation filter to enhance speaker response − Proprietary audio post-processing technology: BesLoudness (MB-DRC), BesSurround, Android built-in post-processing − Audio encoding: AMR-NB, AMR-WB, AAC, OGG, ADPCM − Audio decoding: WAV, MP3, MP2, AAC, AMR-NB, AMR-WB, MIDI, Vorbis, APE, AAC-plus v1, AAC-plus v2, FLAC, WMA, ADPCM − Voice wake-up •vocalization − Voice codecs (FR, HR, EFR, AMR FR, AMRHR and broadband AMR) Telecomm Macau − Noise reduction − Noise suppression − Noise reduction − Dual MIC noise reduction − Echo cancellation − Echo suppression − Dual MIC voice tracking − MagiLoudness (enhanced speech intelligibility based on near-end ambient noise) − MagiClarity (maximizes loudness while controlling the maximum receiver output power; Feedforward receiver protection) − Compensating filters and digital gain for uplink and downlink paths