Product description
The Qualcomm WSA-8815-0-33WLNSP-HR-02-0 is a highly integrated wireless SoC that combines a powerful ARM Cortex-M4 processor, a Wi-Fi 802.11ac transceiver, and a Bluetooth 5.0 Low Energy radio in a compact package. This device is designed to enable the development of high-performance wireless IoT applications, such as smart home hubs, industrial gateways, and multimedia streaming devices.
The ARM Cortex-M4 processor provides a high-performance, energy-efficient core for running advanced application-level software and managing the device's various peripherals. The integrated Wi-Fi 802.11ac and Bluetooth 5.0 Low Energy radios allow the WSA-8815-0-33WLNSP-HR-02-0 to deliver high-speed wireless connectivity and seamless communication with other Bluetooth-enabled devices.
The device's comprehensive set of peripherals, including UART, SPI, I2C, and GPIO interfaces, enables easy integration with a wide range of external sensors and components. This flexibility allows developers to quickly build custom wireless IoT solutions tailored to their specific application requirements.
The WSA-8815-0-33WLNSP-HR-02-0 also features advanced power management capabilities, including support for multiple low-power modes, to optimize energy efficiency and extend the battery life of battery-powered devices. This makes the device well-suited for applications that require high-performance wireless connectivity with low-power consumption.
Overall, the Qualcomm WSA-8815-0-33WLNSP-HR-02-0 is a highly integrated, feature-rich wireless SoC that provides a powerful and efficient platform for the development of a wide range of high-performance IoT applications.
Specification parameters
Processor: ARM Cortex-M4 core operating at up to 120MHz
Wireless Connectivity:
Wi-Fi: IEEE 802.11ac, 2.4GHz
Bluetooth: Bluetooth 5.0 Low Energy (BLE)
Memory:
512KB of on-chip SRAM
4MB of on-chip Flash
Peripherals:
UART, SPI, I2C, and GPIO interfaces
ADC, PWM, and timer modules
Power Supply: 1.8V to 3.6V
Operating Temperature Range: -40°C to +85°C
Package: 33-pin WLNSP (Wafer Level Nano Scale Package)
Dimensions: 3.5mm x 3.5mm x 0.5mm