Product description
The Qualcomm QLN-2830-0-39BBD-R-08-0 is a high-performance electronic component designed to meet the rigorous demands of high-frequency and high-speed applications. Its advanced features and robust construction make it a crucial element in modern electronic systems where precision and reliability are paramount.
Construction and Design: The QLN-2830-0-39BBD-R-08-0 features a Ball Grid Array (BGA) package, which includes a grid of solder balls on the underside of the component. This design enables a high density of connections and contributes to a compact form factor. The BGA packaging also facilitates efficient thermal management, helping to dissipate heat and maintain stable operation during high-frequency use. The component is constructed from high-quality materials to ensure durability and long-term reliability, capable of withstanding various environmental stresses.
Performance: This component is optimized for high-frequency performance, offering precise signal handling across a wide frequency range. It is engineered to manage substantial power levels, making it suitable for high-power applications. Advanced impedance matching and shielding techniques are employed to minimize signal loss and interference, ensuring clear and accurate data transmission. These performance attributes are crucial for maintaining the integrity of high-speed communication and processing systems.
Applications: The QLN-2830-0-39BBD-R-08-0 is versatile and can be applied in various sectors. It supports high-speed data transmission and communication infrastructure in telecommunications. In high-performance computing systems and data centers, it enhances signal processing capabilities and network reliability. Its robustness and durability also make it suitable for use in demanding environments where consistent performance is essential. The component's flexibility ensures that it can meet the needs of different industry sectors, providing reliable operation across a range of applications.
Integration: The compact BGA package design of the QLN-2830-0-39BBD-R-08-0 facilitates easy integration into electronic systems. Its high-density connections and efficient thermal management support seamless integration into circuit boards and other electronic designs. The component’s ability to fit into space-constrained environments without sacrificing performance adds to its versatility and utility in modern electronic systems.
In summary, the Qualcomm QLN-2830-0-39BBD-R-08-0 is a high-performance electronic component that combines advanced technology, robust construction, and versatile application capabilities. Its design ensures efficient operation in high-frequency environments, making it a valuable addition to a wide range of sophisticated electronic systems and applications.
Specification parameters
Frequency Range: The QLN-2830-0-39BBD-R-08-0 is designed to operate across a specified frequency range, supporting various high-speed signal types. This wide frequency range allows it to be compatible with different systems and applications, making it suitable for complex and demanding high-frequency environments.
Power Handling: The component is capable of handling significant power levels, which is crucial for high-power applications. Its design ensures that it can manage these power levels effectively without compromising performance. This capability is important for maintaining system stability and reliability during heavy-load conditions.
Impedance Matching: The QLN-2830-0-39BBD-R-08-0 features precise impedance matching to enhance signal transmission. Proper impedance matching helps reduce reflection losses and optimize signal strength, contributing to better overall system performance and efficiency.
Temperature Range: This model is rated to operate within a specific temperature range, ensuring reliable performance in various environmental conditions. This temperature rating allows the component to function effectively in both standard and extreme conditions, making it suitable for diverse applications.
Dimensions and Form Factor: The BGA package design provides a compact and efficient form factor. The specific dimensions of the QLN-2830-0-39BBD-R-08-0 facilitate integration into space-constrained systems while maintaining robust performance and connectivity. The compact size is advantageous for modern electronic designs that require high density and efficiency.
Connector Type: Utilizing a BGA (Ball Grid Array) configuration, the component offers reliable and stable connections with other electronic components. The BGA design enhances integration into circuit boards and electronic systems, providing a secure and effective interface for high-frequency applications.
