MediaTek

MT5311G

  • The MT5311G is used in telecommunications and consumer electronics, particularly in network-related applications. It is available in a BGA (Ball Grid Array) package, offering efficient heat dissipation and compact design, suitable for modern consumer electronics where space and thermal performance are crucial.

Product Description

The MT5311G series includes the MT5311G/AMAH, which is one of the variations seen in electronics distribution platforms. This IC provides advanced performance with low power consumption, making it suitable for devices that require extended battery life without compromising functionality. Its application in consumer electronics could involve multimedia, network connectivity, or low-latency communication systems.

The MT5311 is used in telecommunications and consumer electronics, particularly in network-related applications.

It is available in a BGA (Ball Grid Array) package, offering efficient heat dissipation and compact design, suitable for modern consumer electronics where space and thermal performance are crucial.

The device is compliant with the RoHS (Restriction of Hazardous Substances) directive, meaning it is free from harmful substances, ensuring environmental safety and compatibility with global standards.


Specification

  • Integrated Circuit (IC) Platform: The MT5311 is used in telecommunications and consumer electronics, particularly in network-related applications.

  • Form Factor: It is available in a BGA (Ball Grid Array) package, offering efficient heat dissipation and compact design, suitable for modern consumer electronics where space and thermal performance are crucial.

  • RoHS Compliance: The device is compliant with the RoHS (Restriction of Hazardous Substances) directive, meaning it is free from harmful substances, ensuring environmental safety and compatibility with global standards

  • Packaging: The MT5311 is typically available in Tape & Reel or Tray packaging for automated assembly processes. It ensures the parts are ready for integration into manufacturing lines.

  • Lead-Free: The component is lead-free, complying with environmental standards


  • Use Cases: Often used in devices where compact, low-power integrated solutions are necessary. It can be employed in IoT applications, wireless communication, and mobile devices, providing a balance between functionality and size.


Product View

Related Products