MediaTek

MT5921P

  • High Integration: The MT5921P integrates Wi-Fi and Bluetooth functionality into a single chip, offering both Wi-Fi (802.11 a/b/g/n/ac/ax) and Bluetooth (5.2) connectivity.
  • Dual-band Support: The chip supports dual-band Wi-Fi (2.4 GHz and 5 GHz), with bandwidths of 20 MHz, 40 MHz, and 80 MHz for 5 GHz, ensuring high-speed data transmission.
  • Bluetooth 5.2: The chip supports Bluetooth Low Energy (BLE) and advanced features like Isochronous channels and multiple device connections (up to 7 BT links and 16 BLE links).

Product Description

The MT5921P is ideal for applications in consumer electronics, IoT devices, and smart home products where high-speed wireless connectivity and power efficiency are crucial. The dual-band Wi-Fi with MU-MIMO and Beamforming provides excellent performance even in crowded network environments, making it suitable for environments requiring stable and high throughput connections, like streaming media and connected devices. Its Bluetooth capabilities are enhanced by the latest Bluetooth 5.2 standard, enabling long-range communication, and supporting both high-speed data transfers and power-efficient connections.

  • High Integration: The MT5921P integrates Wi-Fi and Bluetooth functionality into a single chip, offering both Wi-Fi (802.11 a/b/g/n/ac/ax) and Bluetooth (5.2) connectivity.

  • Power Efficiency: It features a low-power design, suitable for battery-operated devices, ensuring minimal power consumption during both active and idle states.

  • Dual-band Support: The chip supports dual-band Wi-Fi (2.4 GHz and 5 GHz), with bandwidths of 20 MHz, 40 MHz, and 80 MHz for 5 GHz, ensuring high-speed data transmission.

  • Bluetooth 5.2: The chip supports Bluetooth Low Energy (BLE) and advanced features like Isochronous channels and multiple device connections (up to 7 BT links and 16 BLE links).

  • Advanced Wi-Fi Features: It supports MU-MIMO, beamforming, and DBDC (Dual Band Dual Concurrent), which enhance multi-device performance and wireless efficiency.

  • Optimized Performance: The chipset is designed to work with an integrated low-noise amplifier (LNA) and power amplifier (PA), which contribute to improving signal strength and stability.


Specification

  • Wi-Fi Standards: IEEE 802.11 a/b/g/n/ac/ax

  • Bluetooth Standards: Bluetooth 5.2, with support for BLE and EDR

  • Package: 11.5 x 8.7 mm, 109-pin DRQFN

  • Power Supply: 3.3V input with integrated power management

  • Operating Temperature: -10°C to 70°C

  • Host Interface: PCIe v2.1 for efficient communication with host processors

  • Power Efficiency: It features a low-power design, suitable for battery-operated devices, ensuring minimal power consumption during both active and idle states.

  • Dual-band Support: The chip supports dual-band Wi-Fi (2.4 GHz and 5 GHz), with bandwidths of 20 MHz, 40 MHz, and 80 MHz for 5 GHz, ensuring high-speed data transmission.

  • Advanced Wi-Fi Features: It supports MU-MIMO, beamforming, and DBDC (Dual Band Dual Concurrent), which enhance multi-device performance and wireless efficiency.

  • Optimized Performance: The chipset is designed to work with an integrated low-noise amplifier (LNA) and power amplifier (PA), which contribute to improving signal strength and stability.


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