Product description
The MTK MT6167A/A is a sophisticated RF transceiver designed to meet the demands of next-generation wireless communication systems. Its integration of critical RF components into a compact form factor simplifies design, reduces development time, and minimizes manufacturing costs.
This transceiver supports multi-band and multi-mode operations, allowing seamless transitions between various communication standards. Its advanced RF architecture ensures high linearity, low noise, and minimal distortion, enabling superior signal integrity even in interference-prone environments.
The MT6167A/A is engineered for low power consumption, making it ideal for battery-operated devices such as smartphones, tablets, and IoT devices. Its energy-efficient operation extends device runtime while maintaining consistent performance.
With its compact WLCSP/QFN packaging, the MT6167A/A fits seamlessly into space-constrained designs, such as wearables and small-form-factor IoT modules. Its programmable features allow developers to customize the transceiver's operation for specific use cases, from high-speed LTE communications to low-power IoT networks.
The transceiver's wide frequency range ensures compatibility with global communication standards, making it an ideal choice for devices targeting international markets. Its robust operating temperature range and durable construction also make it suitable for industrial-grade applications, providing reliability in challenging environments.
Specification parameters
Frequency Range: 400 MHz to 3.8 GHz, covering key cellular bands
Supported Standards: GSM, EDGE, WCDMA, LTE (up to Cat-10)
Channel Bandwidth: Up to 20 MHz for LTE applications
Receiver Sensitivity: < -100 dBm, ensuring reliable operation in low-signal environments
Transmit Power: Configurable to meet application-specific and regulatory requirements
Supply Voltage: Operates efficiently between 2.8V and 4.2V
Current Consumption: Ultra-low standby current < 1.5 mA and active operation current < 50 mA
Package Type: Compact WLCSP/QFN packaging for flexible device integration
Operating Temperature: -40°C to +85°C, suitable for consumer and industrial-grade devices
Interfaces: SPI and MIPI RFFE for integration with baseband processors