MediaTek

MT6169V

  • The MT6169V is a MediaTek wireless transceiver integrated circuit (IC) designed for mobile applications, notably supporting LTE and 3GPP standards. It is typically used in conjunction with LTE modems, such as the MT6290, and plays a critical role in managing radio frequency (RF) transmissions.

Product Description

The MT6169V is particularly beneficial in mobile devices, such as smartphones, where network flexibility and signal integrity are paramount. It integrates multiple transmitters and receivers in a compact form, reducing the number of external components required for signal processing. By supporting both LTE and legacy 3GPP standards, it ensures compatibility with a broad array of mobile networks, enabling devices to work across various regions without the need for specific tuning for different bands. This chip is widely used in devices like the Meizu MX5.

  • Multi-band Support: The MT6169V supports a wide range of LTE bands and is adaptable to various RF band requirements globally. It can handle up to 30 3GPP bands, making it versatile across different mobile network standards.

  • Advanced RF Transceiver: It integrates multiple RF functionalities into a single IC, streamlining design and improving power efficiency.

  • Multiple RF Inputs: The MT6169V supports up to eight primary RF inputs, categorized into high, mid, and low bands, with additional RF inputs for diversity gains, enhancing signal quality and network performance.


Specification

  • Multi-band Support: The MT6169V supports a wide range of LTE bands and is adaptable to various RF band requirements globally. It can handle up to 30 3GPP bands, making it versatile across different mobile network standards.

  • Advanced RF Transceiver: It integrates multiple RF functionalities into a single IC, streamlining design and improving power efficiency.

  • Multiple RF Inputs: The MT6169V supports up to eight primary RF inputs, categorized into high, mid, and low bands, with additional RF inputs for diversity gains, enhancing signal quality and network performance.

  • Package: The chip comes in a BGA (Ball Grid Array) package, suitable for high-density applications.

  • Operating Compatibility: It works seamlessly with various mobile devices, including those equipped with the MT6290 LTE modem.

  • Global RF Band Configuration: The chip is designed for flexibility in meeting the RF band needs of mobile operators across different regions.


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