Product Description
The MT6177M is a key component in enabling high-speed, reliable wireless communication. It integrates several functions into a compact module, making it ideal for mobile phones and other portable devices. The RF system of the chip is designed with enhanced input/output (I/O) paths for both RX (receive) and TX (transmit), ensuring that signals are efficiently processed with minimal interference. This chip supports various communication standards, focusing heavily on LTE technologies.
Its low-power consumption is crucial for maintaining battery life in portable devices, while the diversity receiver configuration ensures robust performance in environments where signal conditions are less than ideal. By supporting multiple LTE bands and incorporating software-configurable options, the MT6177M is a versatile choice for global device deployment
Specification
LTE Support: The MT6177M is capable of supporting multiple LTE bands, offering excellent data throughput for mobile and wireless applications. It supports up to 20 MHz bandwidth in LTE mode, ideal for robust mobile connectivity and high-speed data transfer.
Form Factor: The chip uses a compact Wirebond VFBGA package with a body size of 5.0x4.6x0.9mm and a ball spacing of 0.4mm, making it suitable for integration into space-constrained applications.
Voltage Supply: The chip requires multiple voltage inputs, including VDD_RXHF (1.8V) for RF DCDC supply and VDD_RXLV (1.2V) for low-voltage RF supply, optimizing power efficiency for mobile devices.
Pin Configuration: The MT6177M includes a variety of RF and baseband interface pins. These pins are used for RX and TX paths, including I/Q output for both main and diversity receivers, as well as pins for baseband processing and external control signals
