Mobile Station Modem

MSM-8210-3-488NSP-MT-02-0

  • Power Efficiency: Designed with advanced power management technologies, the MSM-8210-3 optimizes energy consumption, making it ideal for battery-operated devices. This feature is particularly important for IoT applications that require long operational lifetimes without frequent recharging.

Product description

The Qualcomm MSM-8210-3-488NSP-MT-02-0 is engineered to meet the demands of modern mobile and IoT applications. Its architecture is optimized for both performance and efficiency, making it a preferred choice for manufacturers looking to develop cutting-edge devices.

The integration of multiple functionalities into a single chip reduces the overall footprint of the device, allowing for sleeker designs without compromising on performance. This is particularly advantageous for manufacturers aiming to create compact devices that can operate efficiently in various environments.

In terms of multimedia capabilities, the MSM-8210-3 supports a wide range of video formats and resolutions, enabling devices to deliver high-quality visual experiences. This is especially beneficial for applications in entertainment, media consumption, and video conferencing, where user experience is critical.

Moreover, the security features embedded within the chip address the growing concerns around data privacy and protection. With the increasing prevalence of cyber threats, having a secure platform is essential for maintaining user trust and compliance with regulations.

Overall, the Qualcomm MSM-8210-3-488NSP-MT-02-0 stands out as a versatile and powerful SoC that caters to a wide range of applications, from consumer electronics to industrial IoT solutions. Its combination of performance, energy efficiency, and security makes it a valuable component in the rapidly evolving technology landscape, positioning it as a preferred choice for developers and manufacturers alike.


Specification parameters

  • CPU Architecture: The MSM-8210-3 typically features a quad-core CPU architecture, allowing for efficient multitasking and improved performance in demanding applications.

  • Clock Speed: The chip operates at a maximum clock speed of up to 1.2 GHz, providing sufficient processing power for a wide range of applications, from basic tasks to more complex operations.

  • Memory Support: It supports LPDDR3 memory, with configurations allowing for up to 2 GB of RAM. This memory capacity is adequate for most mobile and IoT applications, enabling smooth operation and responsiveness.

  • Storage Interface: The MSM-8210-3 supports eMMC storage, enabling fast data access and storage capabilities, which is essential for applications that require quick data retrieval.

  • Connectivity Options: The SoC includes support for Wi-Fi, Bluetooth, and GPS, ensuring comprehensive connectivity for various applications, from smart home devices to wearables and industrial sensors.

  • Operating Temperature Range: The chip is designed to operate within a temperature range of -40°C to +85°C, making it suitable for industrial applications and environments with extreme temperature variations.


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