Product description
The Qualcomm MDM-9215M-0-383NSP-MT-04-0 is a highly integrated mobile data modem chip that supports multiple frequency bands and modes. It is designed to provide high-speed data connectivity for mobile devices, including smartphones, tablets, and laptops. The chip features a low power consumption design, making it suitable for battery-powered devices.
The MDM-9215M-0-383NSP-MT-04-0 supports multiple data rates, including up to 150 Mbps downlink and up to 50 Mbps uplink in LTE mode. It also supports WCDMA, TD-SCDMA, and GSM/EDGE modes, making it a versatile solution for mobile devices.
The chip is manufactured using 28nm process technology, which provides a high level of integration and low power consumption. The package is a 12mm x 12mm, 0.5mm pitch, 383-ball BGA, making it suitable for small form factor devices.
Overall, the Qualcomm MDM-9215M-0-383NSP-MT-04-0 is a high-performance mobile data modem chip that provides fast data connectivity and low power consumption, making it an ideal solution for mobile devices.
Specification parameters
Process Technology: 28nm
Frequency Bands:
FDD-LTE: B1, B2, B3, B4, B5, B7, B8, B12, B13, B17, B18, B19, B20, B25, B26, B27, B28, B29, B30, B32, B38, B39, B40, B41
TDD-LTE: B34, B38, B39, B40, B41
WCDMA: B1, B2, B4, B5, B8
TD-SCDMA: B34, B39
GSM/EDGE: 850, 900, 1800, 1900 MHz
Data Rates:
Downlink: up to 150 Mbps (LTE), up to 42 Mbps (WCDMA), up to 236.8 kbps (GSM/EDGE)
Uplink: up to 50 Mbps (LTE), up to 5.76 Mbps (WCDMA), up to 236.8 kbps (GSM/EDGE)
Power Consumption: low power consumption, optimized for mobile devices
Package: 12mm x 12mm, 0.5mm pitch, 383-ball BGA
