Product Description
The Qualcomm MDM-9225-0-384BNSP-MT-03-0 is a highly integrated mobile data modem chip that supports multiple frequency bands and modes. It is designed to provide high-speed data connectivity for mobile devices, including smartphones, tablets, and laptops. The chip features a low power consumption design, making it suitable for battery-powered devices.
The MDM-9225-0-384BNSP-MT-03-0 supports multiple data rates, including up to 150 Mbps downlink and up to 50 Mbps uplink in LTE mode. It also supports WCDMA, TD-SCDMA, and GSM/EDGE modes, making it a versatile solution for mobile devices.
The chip is manufactured using 28nm process technology, which provides a high level of integration and low power consumption. The package is a 12mm x 12mm, 0.5mm pitch, 384-ball BGA, making it suitable for small form factor devices.
In addition to its technical specifications, the MDM-9225-0-384BNSP-MT-03-0 also features a number of advanced technologies, including carrier aggregation, MIMO, and LTE Advanced. These technologies allow for faster data speeds, improved network performance, and increased capacity.
The MDM-9225-0-384BNSP-MT-03-0 also supports VoLTE, which allows for high-quality voice calls over LTE networks. This feature is particularly important for mobile devices, as it enables users to make voice calls over LTE networks, which can provide better voice quality and lower latency compared to traditional voice networks.
Overall, the Qualcomm MDM-9225-0-384BNSP-MT-03-0 is a high-performance mobile data modem chip that provides fast data connectivity, low power consumption, and advanced features, making it an ideal solution for mobile devices.
Specification
Process Technology: 28nm
Frequency Bands:
FDD-LTE: B1, B2, B3, B4, B5, B7, B8, B12, B13, B17, B18, B19, B20, B25, B26, B27, B28, B29, B30, B32, B38, B39, B40, B41
TDD-LTE: B34, B38, B39, B40, B41
WCDMA: B1, B2, B4, B5, B8
TD-SCDMA: B34, B39
GSM/EDGE: 850, 900, 1800, 1900 MHz
Data Rates:
Downlink: up to 150 Mbps (LTE), up to 42 Mbps (WCDMA), up to 236.8 kbps (GSM/EDGE)
Uplink: up to 50 Mbps (LTE), up to 5.76 Mbps (WCDMA), up to 236.8 kbps (GSM/EDGE)
Power Consumption: low power consumption, optimized for mobile devices
Package: 12mm x 12mm, 0.5mm pitch, 384-ball BGA
