Modem Chip

MDM-9625M-O-333NSP-TR-03-1-BA

  • Advanced LTE Connectivity: The MDM-9625M offers high-speed LTE connectivity, supporting various frequency bands. This enables robust and reliable mobile broadband connections, essential for applications such as IoT and automotive telematics.
  • Integrated Processing Power: The module integrates a powerful processor capable of handling complex computations and multitasking. This is vital for applications that require real-time data processing, such as video streaming and navigation.

Product description

The Qualcomm MDM-9625M-O-333NSP-TR-03-1-BA is a cutting-edge wireless communication module that excels in providing reliable, high-speed connectivity across multiple network technologies. Its design is optimized for both performance and energy efficiency, making it an ideal choice for a wide range of applications, including IoT devices, automotive solutions, and industrial automation.

This module is particularly notable for its support of LTE networks, which allows for high-speed data transfer, low latency, and improved user experience in mobile applications. The integration of various communication protocols ensures that it can adapt to different network conditions, providing versatility for developers and manufacturers.

The powerful integrated processor within the MDM-9625M enables advanced processing capabilities, allowing it to manage complex tasks and applications seamlessly. This is particularly beneficial for scenarios that require real-time processing, such as video surveillance and remote monitoring.

Moreover, the low power consumption characteristic makes this module suitable for deployment in devices where battery life is critical. By optimizing power usage, it helps in extending the operational lifespan of connected devices, thereby reducing maintenance and operational costs.

In summary, the Qualcomm MDM-9625M-O-333NSP-TR-03-1-BA represents a robust solution for modern wireless communication needs, with its combination of advanced features, versatile specifications, and detailed engineering designed to meet the demands of today's interconnected world. Its adaptability and performance make it a preferred choice for developers seeking to build reliable and efficient communication systems.


Specification parameters

  • Dimensions: Compact form factor for easy integration into various devices.

  • Operating Temperature Range: Typically designed to operate in a wide range of temperatures, suitable for harsh environments.

  • Power Supply: Operates on a standard voltage input, which simplifies integration into existing systems.

  • Data Rates: Supports high data rates for both uplink and downlink, optimizing user experience in data-intensive applications.

  • Interface: Includes various interfaces such as USB, UART, and SPI for flexible connectivity options.


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