Network RF Chip

QCN-9274-0-MSP264-MT-01-0-01

  • Wi-Fi 6 (802.11ax) Technology: The QCN-9274 supports the latest Wi-Fi 6 standard, which significantly improves data throughput, network capacity, and overall performance in high-density environments. Key technologies such as OFDMA (Orthogonal Frequency Division Multiple Access) and MU-MIMO (Multi-User Multiple Input Multiple Output) allow multiple devices to connect and transmit data simultaneously, enhancing the efficiency of wireless networks.
  • Enhanced Bluetooth 5.2: With support for Bluetooth 5.2, this chipset provides an increased data transfer rate, extended range, and improved broadcast capabilities. This is particularly beneficial for devices that require reliable connections for audio streaming, data synchronization, and other applications where low latency is crucial.
  • Robust Security Features: The QCN-9274 incorporates advanced security protocols, including WPA3, which enhances protection against unauthorized access and ensures secure communication between devices. This is essential for applications dealing with sensitive information, such as financial transactions or personal data exchanges.

Product description

The Qualcomm QCN-9274-0-MSP264-MT-01-0-01 is engineered to meet the challenges of next-generation wireless connectivity. Its support for Wi-Fi 6 not only enhances speed and efficiency but also ensures that devices can communicate seamlessly even in crowded environments where multiple connections are active. This capability is particularly critical in smart home applications, where numerous devices, such as security cameras, smart speakers, and home automation systems, are often connected simultaneously.

Bluetooth 5.2 integration expands the QCN-9274’s versatility, enabling it to cater to a wide range of applications from audio devices to wearables. With increased data rates and range, devices can interact more effectively, providing users with a superior experience. This is especially important in applications like audio streaming, where latency and connection reliability are key.

In addition to its advanced connectivity features, the QCN-9274 is designed with an emphasis on power efficiency, making it ideal for IoT devices that rely on batteries. The various power-saving modes allow developers to optimize their devices for longer operational lifetimes, reducing the frequency of battery replacements or recharges. This is essential for applications deployed in remote or hard-to-access locations.

The chipset’s robust security features, including support for WPA3, are crucial in today’s security-conscious landscape. As IoT devices become more prevalent, ensuring that data is transmitted securely between devices is paramount to protect users' privacy and sensitive information.

Overall, the Qualcomm QCN-9274-0-MSP264-MT-01-0-01 stands out as a highly capable wireless chipset that addresses the evolving demands of modern connectivity. Its combination of advanced features, impressive specifications, and commitment to energy efficiency and security makes it an excellent choice for developers looking to create innovative connected devices in various domains, including smart homes, industrial applications, and consumer electronics.


Specification parameters

  1. Wireless Standards:

    • Wi-Fi: 802.11ax (Wi-Fi 6)

    • Bluetooth: 5.2

  2. Frequency Bands:

    • Dual-band operation on 2.4 GHz and 5 GHz frequencies to optimize network performance and reduce interference.

  3. Data Throughput:

    • Maximum Wi-Fi Data Rate: Up to 1.8 Gbps, facilitating high-speed data transfer and supporting demanding applications such as HD video streaming and online gaming.

    • Bluetooth Data Rate: Up to 2 Mbps, ensuring quick and efficient data communication.

  4. Antenna Configuration:

    • Supports 2x2 MIMO technology, enhancing performance and coverage by utilizing multiple antennas for simultaneous data streams.

  5. Power Specifications:

    • Operating Voltage: 3.3V, which is standard for many wireless communication devices.

    • Power Consumption: Approximately 90 mW in low-power mode, making it suitable for energy-sensitive applications.

  6. Operating Temperature Range:

    • -40°C to 85°C, ensuring reliable performance in a variety of environmental conditions, including industrial applications.

  7. Interface Options:

    • SPI, UART, and SDIO interfaces allow for flexible connectivity with other components and devices.


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