Networking Chip

IPQ-5322-0-MRQFN251-MT-00-0

  • High-Performance Multi-Core Processor: The Qualcomm IPQ-5322 features an advanced multi-core architecture, typically integrating high-performance ARM Cortex cores. This design allows the SoC to efficiently handle demanding applications such as 4K video streaming, online gaming, and high-speed data processing.
  • Wi-Fi 6E Capability: This SoC supports the latest Wi-Fi 6E standard (802.11ax), which extends the capabilities of Wi-Fi into the 6 GHz band. This addition provides increased bandwidth, reduced interference, and improved overall network performance, particularly in environments with numerous connected devices.

Product description

The Qualcomm IPQ-5322-0-MRQFN251-MT-00-0 is a state-of-the-art System on Chip (SoC) designed to meet the demands of modern networking applications. It is built on a high-performance multi-core architecture, typically featuring ARM Cortex cores capable of clock speeds up to 2.4 GHz. This level of processing power is essential for efficiently managing high-bandwidth tasks, such as streaming high-definition video, handling multiple connections, and supporting data-intensive applications.

A standout feature of the IPQ-5322 is its support for Wi-Fi 6E (802.11ax), which not only enhances the existing capabilities of Wi-Fi 6 but also introduces access to the newly allocated 6 GHz band. This tri-band operation allows for significantly increased bandwidth, lower latency, and reduced interference, providing users with a seamless and fast internet experience, even in environments saturated with connected devices. The integration of technologies such as Multi-User Multiple Input Multiple Output (MU-MIMO) and Orthogonal Frequency-Division Multiple Access (OFDMA) further enhances performance, enabling the SoC to serve multiple devices efficiently without degrading connection quality.

Security is a primary focus of the IPQ-5322, incorporating advanced protocols like WPA3 to provide robust protection against cyber threats. This ensures that data transmitted over the network is secure, making it particularly valuable in environments where sensitive information is shared among connected devices.

In terms of connectivity, the IPQ-5322 offers multiple Gigabit Ethernet ports, facilitating high-speed wired connections that complement its powerful wireless capabilities. This versatility makes it suitable for various applications, from home routers to enterprise-level access points. Additionally, support for eMMC and SD card interfaces allows manufacturers to implement flexible storage solutions tailored to specific product needs.

The design of the IPQ-5322 emphasizes scalability and efficiency, allowing it to be integrated into a broad range of networking devices with ease. Its compact MRQFN251 package enables manufacturers to incorporate this SoC into various product designs without sacrificing performance.

Operating effectively across a wide temperature range of -40°C to 85°C, the IPQ-5322 is capable of functioning in diverse environments, from residential settings to industrial applications. This robustness ensures reliability and durability in various deployment scenarios.

In summary, the Qualcomm IPQ-5322-0-MRQFN251-MT-00-0 is a powerful and versatile networking solution, combining high-performance processing, advanced Wi-Fi 6E capabilities, robust security features, and flexible connectivity options. It is an excellent choice for manufacturers and consumers seeking reliable and efficient platforms for modern networking needs.


Specification parameters

  • Processor: Multi-core ARM Cortex architecture (specific cores may vary)

  • Clock Speed: Up to 2.4 GHz, providing high-performance computing capabilities

  • Memory Support: Up to 2 GB DDR4 RAM for improved multitasking performance

  • Wireless Standards:

    • Wi-Fi 6E (802.11ax) support with tri-band operation (2.4 GHz, 5 GHz, and 6 GHz)

  • Ethernet: Multiple Gigabit Ethernet ports for high-speed wired connections

  • Storage Options: Support for eMMC and SD card interfaces for flexible storage solutions

  • Power Consumption: Optimized for low power usage, enhancing energy efficiency

  • Operating Temperature Range: -40°C to 85°C, making it suitable for diverse environments

  • Chip Package: MRQFN251, compact form factor for seamless integration into devices


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