Networking Chip

IPQ-5322-0-MRQFN251-MT-03-0

  • High-Performance Multi-Core Processing: The Qualcomm IPQ-5322 utilizes a high-performance multi-core architecture, typically featuring ARM Cortex cores. This design is optimized for handling demanding tasks, allowing for smooth and efficient operation in applications such as video streaming, gaming, and other data-intensive activities.
  • Wi-Fi 6E Compatibility: This SoC supports Wi-Fi 6E (802.11ax), enabling tri-band connectivity across 2.4 GHz, 5 GHz, and the new 6 GHz spectrum. This advancement provides greater bandwidth, reduced latency, and minimized interference, ensuring optimal performance in environments with numerous connected devices.

Product description

The Qualcomm IPQ-5322-0-MRQFN251-MT-03-0 is a state-of-the-art System on Chip (SoC) engineered for high-performance networking applications. At its core, it features a multi-core architecture, typically built on ARM Cortex technology, capable of reaching clock speeds of up to 2.4 GHz. This processing power is essential for efficiently handling high-bandwidth tasks, making it ideal for scenarios such as streaming ultra-high-definition video, engaging in online gaming, and managing multiple concurrent connections.

A defining characteristic of the IPQ-5322 is its support for Wi-Fi 6E (802.11ax), which significantly enhances wireless performance. By leveraging tri-band capabilities across the 2.4 GHz, 5 GHz, and newly allocated 6 GHz bands, the SoC can provide increased bandwidth and reduced latency. This is particularly advantageous in environments with high device density, such as smart homes and enterprise settings. Features like Multi-User Multiple Input Multiple Output (MU-MIMO) and Orthogonal Frequency-Division Multiple Access (OFDMA) allow the chip to serve multiple devices simultaneously, enhancing overall network efficiency and user experience.

Security is a critical focus for the IPQ-5322, with built-in support for the latest WPA3 security protocol. This ensures secure connections for all devices on the network, protecting sensitive data from unauthorized access and potential cyber threats. As the number of connected devices grows, the importance of robust security measures becomes increasingly paramount.

In terms of connectivity, the IPQ-5322 is equipped with multiple Gigabit Ethernet ports, facilitating high-speed wired connections that complement its advanced wireless capabilities. This versatility allows it to be used in various applications, from home routers to enterprise networking equipment. Additionally, the support for eMMC and SD card interfaces provides flexibility in storage solutions, enabling manufacturers to tailor their products to specific needs.

The design of the IPQ-5322 emphasizes scalability and energy efficiency. It operates effectively across a wide temperature range of -40°C to 85°C, making it suitable for diverse deployment scenarios, including industrial applications. Its compact MRQFN251 package allows for easy integration into various devices, enabling manufacturers to innovate while ensuring high performance.

In summary, the Qualcomm IPQ-5322-0-MRQFN251-MT-03-0 is a powerful and versatile networking solution that combines high-performance processing, advanced Wi-Fi 6E capabilities, robust security features, and flexible connectivity options. It is an excellent choice for manufacturers and consumers looking for a reliable and efficient platform to meet the demands of modern networking needs.


Specification parameters

  • Processor: Multi-core ARM Cortex architecture (exact cores may vary)

  • Clock Speed: Up to 2.4 GHz, delivering high-performance capabilities

  • Memory Support: Up to 2 GB DDR4 RAM for enhanced multitasking

  • Wireless Standards:

    • Wi-Fi 6E (802.11ax) support with tri-band operation (2.4 GHz, 5 GHz, and 6 GHz)

  • Ethernet: Multiple Gigabit Ethernet ports for high-speed wired connections

  • Storage Options: Support for eMMC and SD card interfaces, enabling flexible storage solutions

  • Power Consumption: Optimized for low power usage, enhancing overall energy efficiency

  • Operating Temperature Range: -40°C to 85°C, suitable for various environmental conditions

  • Chip Package: MRQFN251, compact design facilitating easy integration


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