Networking Chip

IPQ-6000-0-FCBGA570-TR-00-0

  • Wi-Fi 6E Technology: This SoC is equipped with support for Wi-Fi 6E (802.11ax), which extends the benefits of Wi-Fi 6 into the newly allocated 6 GHz frequency band. This tri-band capability (2.4 GHz, 5 GHz, and 6 GHz) significantly increases overall network throughput, reduces latency, and minimizes interference from other devices. As a result, users experience improved wireless performance, especially in environments with numerous connected devices, such as smart homes and enterprise networks.

Product description

The Qualcomm IPQ-6000-0-FCBGA570-TR-00-0 is an advanced System on Chip (SoC) designed to meet the high-performance demands of modern networking applications. At its core, it features a multi-core architecture, typically comprising the latest ARM Cortex cores capable of achieving clock speeds of up to 2.5 GHz. This powerful processing capability is essential for managing a range of tasks, from streaming ultra-high-definition video to supporting multiple simultaneous connections in busy environments.

A significant highlight of the IPQ-6000 is its support for Wi-Fi 6E (802.11ax). This technology introduces access to the 6 GHz frequency band, alongside the traditional 2.4 GHz and 5 GHz bands, facilitating tri-band connectivity. This enhancement allows for increased bandwidth and reduced latency, which are particularly beneficial in settings with a high density of devices. The integration of technologies such as Multi-User Multiple Input Multiple Output (MU-MIMO) and Orthogonal Frequency-Division Multiple Access (OFDMA) further enhances its ability to efficiently serve multiple users at once, ensuring a high-quality experience for all connected devices.

Security is a critical feature of the IPQ-6000, incorporating advanced protocols like WPA3 to protect wireless communications. This ensures that data transmitted across the network remains secure from unauthorized access and cyber threats, a vital consideration as the number of connected devices continues to grow. By providing robust security measures, the IPQ-6000 helps maintain the integrity of sensitive information.

The IPQ-6000 also offers extensive connectivity options, including multiple Gigabit Ethernet ports, which support high-speed wired connections. This versatility makes it suitable for various applications, from home networking solutions to enterprise-grade systems. Additionally, the SoC supports eMMC and SD card interfaces, providing flexible storage solutions that can be tailored to meet specific product requirements.

Designed with energy efficiency in mind, the IPQ-6000 minimizes power consumption while delivering high performance. Its scalability allows for seamless integration into a wide range of devices, enabling manufacturers to innovate and create solutions that meet modern networking demands. Operating effectively across a broad temperature range of -40°C to 85°C, the IPQ-6000 is suitable for diverse environments, including industrial applications.

In summary, the Qualcomm IPQ-6000-0-FCBGA570-TR-00-0 is a powerful and versatile networking solution that combines advanced processing capabilities, state-of-the-art Wi-Fi 6E support, robust security features, and flexible connectivity options. It stands out as an excellent choice for manufacturers and consumers seeking reliable and efficient platforms for modern networking applications, positioning it as a leader in next-generation networking technology.


Specification parameters

  • Processor: Multi-core ARM Cortex architecture (exact cores may vary)

  • Clock Speed: Up to 2.5 GHz, providing robust processing capabilities for high-demand applications

  • Memory Support: Up to 4 GB DDR4 RAM for enhanced multitasking capabilities

  • Wireless Standards:

    • Wi-Fi 6E (802.11ax) with tri-band support (2.4 GHz, 5 GHz, and 6 GHz)

  • Ethernet: Multiple Gigabit Ethernet ports for high-speed wired connections

  • Storage Options: Supports eMMC and SD card interfaces, allowing for flexible storage solutions

  • Power Consumption: Optimized for low power usage, enhancing overall energy efficiency

  • Operating Temperature Range: -40°C to 85°C, suitable for a variety of environments

  • Chip Package: FCBGA570, compact form factor for easy integration into devices


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