Networking Chip

IPQ-8062-0-379FCBGA-MT-01-0

  • Dual-Band Wi-Fi Support: The IPQ-8062 supports dual-band Wi-Fi, including 802.11ac (Wi-Fi 5) on both the 2.4 GHz and 5 GHz bands. This enables devices to leverage the benefits of dual-band connectivity, allowing for greater throughput and reduced interference. The integration of technologies such as MU-MIMO (Multi-User Multiple Input Multiple Output) ensures that multiple devices can connect and operate simultaneously without sacrificing performance, making it ideal for smart home environments and busy networks.

Product description

The Qualcomm IPQ-8062-0-379FCBGA-MT-01-0 is a high-performance System on Chip (SoC) designed specifically for modern networking applications. Built on a quad-core ARM Cortex-A53 architecture, the IPQ-8062 provides impressive processing capabilities with clock speeds of up to 1.7 GHz. This processing power is crucial for managing a range of tasks, from streaming high-definition content to handling multiple connections in environments like smart homes and enterprise networks.

One of the standout features of the IPQ-8062 is its support for dual-band Wi-Fi, specifically 802.11ac (Wi-Fi 5). This allows for simultaneous operation on both the 2.4 GHz and 5 GHz bands, significantly improving wireless performance and reducing latency. Users benefit from increased bandwidth and the ability to connect more devices without experiencing a drop in service quality. The incorporation of MU-MIMO technology enables multiple users to connect and utilize the network at the same time, which is especially beneficial in busy households or office environments.

Security is a top priority for the IPQ-8062, which integrates robust security protocols such as WPA2 and advanced firewall capabilities. These features help protect against unauthorized access and various cyber threats, ensuring that all data transmitted over the network remains secure. In an era where cyber threats are increasingly sophisticated, having reliable security measures in place is essential for maintaining user trust and data integrity.

In terms of connectivity, the IPQ-8062 is equipped with multiple Gigabit Ethernet ports that facilitate high-speed wired connections. This makes it suitable for a wide range of applications, from consumer routers to enterprise networking solutions. The ability to connect devices via Ethernet complements the wireless capabilities, providing users with options based on their connectivity needs.

The IPQ-8062 is also designed with energy efficiency in mind. Optimizations in its architecture minimize power consumption while maintaining high performance levels, contributing to reduced operational costs. This energy-efficient design is increasingly important as manufacturers look for ways to create sustainable and cost-effective networking solutions.

Operating effectively across a temperature range of -40°C to 85°C, the IPQ-8062 is suitable for various deployment scenarios, including industrial applications. Its compact 379FCBGA package allows for easy integration into a wide variety of hardware designs, making it an attractive choice for manufacturers aiming to deliver next-generation networking products.

In summary, the Qualcomm IPQ-8062-0-379FCBGA-MT-01-0 is a powerful and versatile networking solution that combines high-performance processing capabilities, dual-band Wi-Fi support, robust security features, and extensive connectivity options. It stands out as an excellent choice for manufacturers and consumers seeking reliable and efficient platforms for modern networking applications, positioning it as a leading option in the next generation of networking technology.


Specification parameters

  • Processor: Quad-core ARM Cortex-A53 architecture

  • Clock Speed: Up to 1.7 GHz, providing efficient processing power

  • Memory Support: Up to 2 GB DDR4 RAM, enhancing multitasking capabilities

  • Wireless Standards:

    • Dual-band Wi-Fi 802.11ac (2.4 GHz and 5 GHz)

  • Ethernet: Multiple Gigabit Ethernet ports for high-speed wired connections

  • Storage Options: Supports eMMC and SD card interfaces for flexible storage solutions

  • Power Consumption: Optimized for low power usage, enhancing overall energy efficiency

  • Operating Temperature Range: -40°C to 85°C, suitable for various deployment environments

  • Chip Package: 379FCBGA, compact design for easy integration into devices


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