Networking Chip

IPQ-8076-0-772FCBGA-MT-00-0

  • Enhanced Wi-Fi 6 Support: This chipset fully supports the Wi-Fi 6 (802.11ax) standard, providing significant improvements in wireless performance. With features like Multi-User Multiple Input Multiple Output (MU-MIMO) and Orthogonal Frequency Division Multiple Access (OFDMA), the IPQ-8076 can manage multiple simultaneous connections effectively. This reduces latency and improves overall network efficiency, especially in environments with high device density.

Product description

The Qualcomm IPQ-8076-0-772FCBGA-MT-00-0 is a high-performance networking chipset that addresses the increasing demands for robust and efficient connectivity in today’s digital landscape. With its octa-core CPU architecture, it is engineered to deliver exceptional processing capabilities, allowing it to handle multiple high-bandwidth applications simultaneously. This is particularly important in environments where numerous devices require consistent and reliable connections.

With full support for Wi-Fi 6 technology, the IPQ-8076 enhances wireless networking performance significantly. The integration of MU-MIMO allows multiple devices to connect simultaneously without experiencing performance degradation, which is critical in settings with high device density, such as offices, schools, and smart homes. OFDMA further optimizes the network by allowing multiple users to share channels more effectively, reducing latency and improving overall throughput.

Security is a paramount concern in networking solutions, and the IPQ-8076 addresses this with a suite of advanced security features. The chipset’s hardware-based encryption and secure boot capabilities ensure that data remains protected against unauthorized access. This level of security is especially vital for enterprise applications where sensitive information is frequently transmitted.

The scalable architecture of the IPQ-8076 allows it to be used in a wide range of applications, from consumer routers designed for home use to high-performance solutions suitable for enterprise-level networking. This flexibility makes it a valuable asset for manufacturers looking to meet diverse market demands.

Additionally, the energy-efficient design of the IPQ-8076 helps to minimize operational costs while promoting sustainability. By reducing power consumption, devices built on this chipset can operate more economically, making it a compelling choice for manufacturers focused on environmental responsibility.

In summary, the Qualcomm IPQ-8076-0-772FCBGA-MT-00-0 is a powerful and versatile chipset that meets the modern demands for high-speed connectivity, robust security, and energy efficiency. Its combination of advanced features and specifications positions it as a leading solution for addressing today’s networking challenges, ensuring reliable performance across various applications.


Specification parameters

  • CPU Configuration: The chipset features an octa-core CPU architecture, with a combination of high-performance and efficiency cores. This setup allows the IPQ-8076 to provide exceptional processing power while optimizing energy use.

  • Memory Support: The IPQ-8076 supports DDR4 memory, providing flexibility in terms of capacity and speed. This support is essential for ensuring optimal performance in data-intensive applications, allowing devices to run smoothly under heavy loads.

  • Connectivity Options: The chipset includes multiple Gigabit Ethernet ports, PCIe lanes for connecting peripherals, and USB interfaces. This range of connectivity options facilitates extensive integration with various devices, enhancing overall data transfer capabilities.

  • Wireless Technologies: In addition to dual-band Wi-Fi (2.4 GHz and 5 GHz), the IPQ-8076 incorporates advanced wireless features, including beamforming technology. This technology enhances signal strength and coverage by directing Wi-Fi signals toward connected devices.

  • Thermal Performance: The chipset is designed to operate efficiently across a wide temperature range, making it suitable for various environments, including indoor and outdoor applications.


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