PMIC

PM-8015-0-136NSP-TR-00-0

  • Over-Voltage Protection (OVP): Prevents output voltage from exceeding safe levels.
  • Over-Current Protection (OCP): Guards against excessive current draw that could damage components.
  • Thermal Shutdown: Protects the IC and connected devices from overheating by shutting down under high-temperature conditions.

Product description

The Qualcomm PM-8015-0-136NSP-TR-00-0 is a versatile and efficient power management integrated circuit designed to meet the demanding power needs of modern electronic devices. Its architecture and feature set make it ideal for a wide array of applications, including smartphones, tablets, IoT devices, and automotive systems.

Application Context

This PMIC is particularly valuable in scenarios where multiple voltage levels are needed simultaneously. For instance:

  • Mobile Devices: Smartphones and tablets benefit from the PM-8015’s ability to efficiently manage power for processors, displays, and communication modules, helping extend battery life and improve user experience.

  • Wearables: Smartwatches and fitness trackers require compact solutions with excellent power management, and the PM-8015 fits this need perfectly.

  • Industrial and Automotive Applications: Its wide operating temperature range and integrated protection features make it suitable for robust applications in varying environments.

Functionality

The PM-8015-0-136NSP-TR-00-0 excels in providing multiple output voltages, which can be tailored to meet the needs of various components. This functionality is critical in systems that demand different voltage levels for optimal performance. The device ensures stable output with low ripple, making it particularly suitable for sensitive electronics.

High efficiency is a hallmark of the PM-8015, reducing thermal output and allowing for cooler operation. This not only prolongs the life of the PMIC itself but also enhances the longevity of other components in the system.

Design Considerations

The compact QFN package allows engineers to integrate the PM-8015 into tight spaces without sacrificing performance. This is particularly important in modern electronics where space optimization is critical. The small size, coupled with the ability to manage multiple outputs, enables designers to create more efficient and compact product designs.

Reliability and Protection

The integrated protection mechanisms, such as over-voltage and over-current protections, contribute to the reliability of the PM-8015. These features help prevent damage to the IC and connected devices, making it a safer choice for critical applications. The thermal shutdown feature further enhances reliability by mitigating risks associated with overheating.

In summary, the Qualcomm PM-8015-0-136NSP-TR-00-0 is a highly efficient, flexible, and compact power management solution. Its combination of multiple output capabilities, integrated protections, and robust design makes it suitable for a broad range of applications in the ever-evolving landscape of electronic devices. Whether utilized in consumer electronics, industrial systems, or automotive applications, it offers the performance and reliability necessary to meet modern power management demands.


Specification parameters

  • Input Voltage Range:

    • Operates within a range of 3.0V to 5.5V, making it compatible with various power sources, including single-cell lithium-ion batteries.

  • Output Current:

    • Supports a maximum output current of up to 1.5A per channel, allowing it to efficiently power multiple components or peripherals.

  • Output Voltage Range:

    • Configurable output voltage typically ranges from 1.0V to 3.3V, accommodating the voltage requirements of different electronic parts.

  • Efficiency:

    • Achieves efficiency rates around 95% under optimal conditions, contributing to lower heat generation and improved reliability.

  • Operating Temperature Range:

    • Designed for operation in a wide temperature range of -40°C to +85°C, making it suitable for both consumer and industrial applications.

  • Package Type:

    • Comes in a compact QFN package, optimizing space and simplifying integration into various designs.


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