PMIC

PM-8901-0-105CSP-TR-06

  • Integrated Power Management: It combines multiple power management functions into a single chip, reducing the need for additional components.
  • Support for Multiple Voltage Rails: The PM-8901 can manage various voltage levels, making it versatile for different components in a device.
  • Thermal Management: It includes features for thermal regulation, ensuring stable operation under varying conditions.

Product Description

The Qualcomm PM-8901-0-105CSP-TR-06 is a sophisticated power management integrated circuit (PMIC) designed to meet the demands of modern mobile devices, including smartphones, tablets, and wearables. As mobile technology continues to evolve, the need for efficient power management solutions has become increasingly critical, and the PM-8901 addresses this need with its advanced features and specifications.

One of the key highlights of the PM-8901 is its ability to optimize power consumption. By efficiently managing power distribution across various components, it significantly enhances battery life, which is a primary concern for users who rely on their devices throughout the day. The PMIC integrates multiple power management functions into a single chip, which not only simplifies the design process for manufacturers but also reduces the overall footprint of the device.

The PM-8901 supports multiple voltage rails, allowing it to cater to different components that require varying voltage levels. This versatility is essential in modern devices, where different parts, such as processors, memory, and sensors, may operate at different voltages. The ability to manage these voltage levels effectively ensures that each component receives the appropriate power, contributing to the overall efficiency and performance of the device.

Thermal management is another critical aspect of the PM-8901. The chip is equipped with features that monitor and regulate temperature, preventing overheating and ensuring stable operation under various conditions. This is particularly important in high-performance devices that may generate significant heat during operation. The integrated thermal shutdown feature provides an additional layer of protection, automatically shutting down the chip if it exceeds safe temperature limits.

The PM-8901 is designed with a compact form factor, making it suitable for space-constrained applications. Its CSP packaging allows for a smaller footprint on the printed circuit board (PCB), which is essential for modern mobile devices that prioritize slim designs. Despite its small size, the PM-8901 does not compromise on performance, offering high efficiency with greater than 90% efficiency under typical load conditions. This high efficiency minimizes energy loss and heat generation, further enhancing the device's overall performance.

In terms of control, the PM-8901 typically utilizes an I2C or similar digital control interface, allowing for easy integration with the device's main processor. This digital control capability enables precise management of power distribution and monitoring, providing manufacturers with the flexibility to optimize their designs according to specific application requirements.

Overall, the Qualcomm PM-8901-0-105CSP-TR-06 is a highly efficient and versatile power management solution that plays a crucial role in the performance and longevity of modern mobile devices. Its advanced features, compact design, and robust protection mechanisms make it an ideal choice for manufacturers looking to enhance the power management capabilities of their products.


Specification

  • Package Type: CSP (Chip Scale Package)

  • Operating Voltage Range: 1.0V to 5.0V

  • Input Voltage Range: 3.0V to 5.5V

  • Output Current: Up to 3A per channel

  • Number of Voltage Rails: Multiple (typically 4-6)

  • Efficiency: Greater than 90% under typical load conditions

  • Thermal Shutdown: Integrated thermal protection features

  • Control Interface: I2C or similar digital control interface

  • Operating Temperature Range: -40°C to +85°C

  • Size: Compact dimensions suitable for mobile applications


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