Product Description
The Qualcomm PM-8937-0-183FOWNSP-TR-00-2 is engineered to meet the demanding power management needs of modern electronic devices. Its architecture is tailored for mobile applications, where power efficiency and space optimization are critical.
The PMIC integrates several voltage regulators, including buck converters and LDOs (Low Drop-Out regulators), allowing it to efficiently manage power distribution across various components. The ability to dynamically adjust output voltages based on real-time processing demands is a significant advantage, as it minimizes wasted energy and prolongs battery life.
In terms of protection features, the PM-8937 includes comprehensive safeguards that protect both the PMIC and the connected components from potential damage due to electrical faults. This is particularly important in mobile devices, where reliability is paramount.
The compact QFN package not only saves space on the PCB but also enhances thermal performance, which is crucial for maintaining operational stability in high-performance applications. The PMIC's thermal management capabilities ensure that it can handle the heat generated during operation, thereby preventing thermal throttling and ensuring consistent performance.
Overall, the Qualcomm PM-8937-0-183FOWNSP-TR-00-2 stands out as a versatile and efficient power management solution, making it an excellent choice for a wide range of applications, from smartphones to IoT devices, where power efficiency, reliability, and compact design are essential.
Specification
Input Voltage Range: Typically operates within a range of 3.0V to 5.5V.
Output Voltage Range: Supports adjustable output voltages, typically from 0.8V to 3.3V.
Output Current: Capable of delivering up to 3A per channel, depending on the configuration.
Switching Frequency: Operates at a switching frequency of approximately 1 MHz, which helps in reducing the size of external components.
Efficiency: Achieves efficiency levels of up to 95% under optimal conditions.
Package Type: Available in a compact QFN (Quad Flat No-lead) package, which enhances thermal performance and reduces PCB space.
Operating Temperature Range: Designed to function effectively in a temperature range of -40°C to +125°C.
